Ink ejection nozzle arrangement

• US 7,896,468 B2
• Filed: 05/31/2009
• Issued: 03/01/2011
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Nguyen; Lamson D
• Application Number:
  US12/475,569
• Publication Number:
  US 20090237461A1
• Time in Patent Office: 639 Days
• Field of Search: 347/40, 347/43, 347/47, 347/64, 347/65
• US Class Current: 347/47
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04573 Timing; Delays
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/04598 Pre-pulse
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/175 : Ink supply systems ; Circuit parts therefor
• CPC Class Codes: B41J 2/17513 : Inner structure
• CPC Class Codes: B41J 2/17553 : Outer structure
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: B41J 2202/21 : Line printing

Abstract

A printhead is provided for an inkjet printer. The printhead includes a wafer assembly defining a plurality of spaced apart groups of ink supply channels and a plurality of groups of ink ejection nozzle arrangements in fluid communication with respective ink supply channel groups. Each ink ejection nozzle arrangement includes a nozzle chamber structure mounted to the wafer assembly. Each ink ejection nozzle arrangement also defines a nozzle chamber for receiving ink from an ink supply channel and a nozzle rim through which ink in the nozzle chamber can be ejected. An anchor extends from the wafer assembly in a location external to the nozzle chamber. An elongate thermal actuator mechanism extends from the anchor and into the nozzle chamber.

Claims

1. An ink ejection nozzle arrangement for an inkjet printhead, the ink ejection nozzle arrangement comprising:

a nozzle chamber structure defining a nozzle chamber, the nozzle chamber having a nozzle defined in a roof of the nozzle chamber;

an anchor extending from the wafer assembly in a location;

an elongate arm attached to a post positioned external to the nozzle chamber, the elongate arm extending from the post and into the nozzle chamber, the elongate arm terminating in a free end within the nozzle chamber; and

a pair of layers of conductive material located on either side of the elongate arm, one of the layers being connected to a current supply so that, upon receipt of the current supply, differential thermal expansion between the pair of layers cause the free end of the elongate arm to deflect, thereby ejecting ink in the nozzle chamber through the nozzle.

2. An ink ejection nozzle arrangement as claimed in claim 1, wherein the layers of conductive material are located proximal to the post.

3. An ink ejection nozzle arrangement as claimed in claim 2, wherein the layers of conductive material abut the post.

4. An ink ejection nozzle arrangement as claimed in claim 2, wherein the layer connected to the current supply has a thinned portion near the post.

5. An ink ejection nozzle arrangement as claimed in claim 1, wherein the layers of conductive material are formed from Titanium Nitrate.

6. An ink ejection nozzle arrangement as claimed in claim 1, further comprising a recess formed substantially around the roof for capturing ink flowing over the roof.