Method for the production of a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip
First Claim
1. A method for the production of a plurality of optoelectronic semiconductor chips each having a plurality of structural elements with respectively at least one semiconductor layer, the method comprising the steps of:
- providing a chip composite base having a substrate and a growth surface;
growing a non-closed mask material layer onto the growth surface in such a way that the mask material layer has a plurality of statistically distributed windows having varying forms and/or opening areas, a mask material being chosen in such a way that a semiconductor material of the semiconductor layer that is to be grown in a later method step essentially cannot grow on said mask material or can grow in a substantially worse manner in comparison with the growth surface;
essentially simultaneously growing semiconductor layers on regions of the growth surface that lie within the windows; and
singulating the chip composite base with applied material to form semiconductor chips each having the plural structural elements arranged alongside one another, the structural elements comprising a semiconductor layer sequence.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for the production of a plurality of optoelectronic semiconductor chips each having a plurality of structural elements with respectively at least one semiconductor layer. The method involves providing a chip composite base having a substrate and a growth surface. A non-closed mask material layer is grown onto the growth surface in such a way that the mask material layer has a plurality of statistically distributed windows having varying forms and/or opening areas, a mask material being chosen in such a way that a semiconductor material of the semiconductor layer that is to be grown in a later method step essentially cannot grow on said mask material or can grow in a substantially worse manner in comparison with the growth surface. Subsequently, semiconductor layers are deposited essentially simultaneously onto regions of the growth surface that lie within the windows. A further method step is singulation of the chip composite base with applied material to form semiconductor chips. An optoelectronic semiconductor component is produced according to the method.
16 Citations
17 Claims
-
1. A method for the production of a plurality of optoelectronic semiconductor chips each having a plurality of structural elements with respectively at least one semiconductor layer, the method comprising the steps of:
-
providing a chip composite base having a substrate and a growth surface; growing a non-closed mask material layer onto the growth surface in such a way that the mask material layer has a plurality of statistically distributed windows having varying forms and/or opening areas, a mask material being chosen in such a way that a semiconductor material of the semiconductor layer that is to be grown in a later method step essentially cannot grow on said mask material or can grow in a substantially worse manner in comparison with the growth surface; essentially simultaneously growing semiconductor layers on regions of the growth surface that lie within the windows; and singulating the chip composite base with applied material to form semiconductor chips each having the plural structural elements arranged alongside one another, the structural elements comprising a semiconductor layer sequence. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification