Air cooling for a phased array radar

• US 7,898,810 B2
• Filed: 12/19/2008
• Issued: 03/01/2011
• Est. Priority Date: 12/19/2008
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Richardson, Ronald J., Ramirez, Erika, Mason, James S., Wilson, James S.
• Primary Examiner(s): Chervinsky; Boris L.
• Assistant Examiner(s): Smith; Courtney
• Application Number:
  US12/340,171
• Publication Number:
  US 20100157531A1
• Time in Patent Office: 802 Days
• Field of Search: 361/679.48, 361/688, 361/689, 361/690, 361/695, 361/607, 361/699, 361/700, 361/692, 361/694, 361/697, 361/701, 361/702, 361/704, 361/707, 361/709, 361/717
• US Class Current: 361/717
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 3/26 varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture H01Q3/12, H01Q3/22, H01Q3/24 take precedence
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Claims

1. A structure for electronic components, comprising:

a baseplate having a substantially planar shape, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate, the baseplate defining one or more openings configured to allow air to flow through the openings;

a frame coupled to the baseplate, the frame comprising;

a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules,

a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums;

a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and

one or more thermal interfaces configured to dissipate heat, the one or more thermal interfaces including at least one thermal pedestal disposed between the planar support and at least one of the one or more transmit/receive modules, the at least one thermal pedestal configured to separate the planar support and one of the one or more transmit/receive modules;

a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat;

one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to at least one of the one or more transmit/receive modules, at least one electronic interface having its own power supply, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces;

one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from the plenums; and

a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the baseplate.

2. A structure for electronic components, comprising:

a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings;

a frame coupled to the baseplate, the frame comprising;

a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules;

a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums;

a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums;

one or more thermal interfaces configured to dissipate heat, the one or more thermal interfaces including at least one thermal pedestal disposed between the planar support and at least one of the one or more transmit/receive modules, the at least one thermal pedestal configured to separate the planar support and one of the one or more transmit/receive modules; and

one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces.

3. The structure of claim 2, further comprising:

a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat.

4. The structure of claim 2, further comprising:

a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the baseplate.

5. The structure of claim 2, further comprising:

one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from the plenums.

6. The structure of claim 2, further comprising:

a radio-frequency transmission medium located within one of the one or more plenums and configured to distribute radio frequency energy.

7. The structure of claim 2, at least one of the one or more electronic interfaces having its own power supply.

8. The structure of claim 2, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate.

9. A structure for electronic components, comprising:

a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings;

a frame coupled to the baseplate, the frame comprising;

a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules;

a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums;

a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and

one or more thermal interfaces configured to dissipate heat;

one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces; and

a desiccant cartridge coupled to the frame, the desiccant cartridge configured to remove moisture from a volume located between the planar support and a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the planar support.

10. A structure for electronic components, comprising:

a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings; and

a frame coupled to the baseplate, the frame comprising;

a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules;

a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums;

a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and

one or more thermal interfaces configured to dissipate heat;

the one or more thermal interfaces including at least one thermal pedestal disposed between the planar support and at least one of the one or more transmit/receive modules, the at least one thermal pedestal configured to separate the planar support and one of the one or more transmit/receive modules.

11. The structure of claim 10, further comprising:

one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces.

12. The structure of claim 10, the planar support further comprising:

a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat; and

a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the baseplate.

13. The structure of claim 10, further comprising:

one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from one of the plenums.

14. The structure of claim 10, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate.

15. A structure for electronic components, comprising:

a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate;

a frame coupled to the baseplate, the frame comprising;

a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules;

a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the plenums; and

one or more thermal interfaces configured to dissipate heat, the one or more thermal interfaces including at least one thermal pedestal disposed between the planar support and at least one of the one or more transmit/receive modules, the at least one thermal pedestal configured to separate the planar support and one of the one or more transmit/receive modules; and

a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat.

16. The structure of claim 15, further comprising:

one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces.

17. The structure of claim 15, wherein the frame further comprises:

a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums.

18. The structure of claim 15, further comprising:

one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from one of the plenums.

19. The structure of claim 15, further comprising:

a radio-frequency transmission medium located within one of the one or more plenums and configured to distribute radio frequency energy.