Solder interconnection array with optimal mechanical integrity
First Claim
1. A method for assembling an electronic module comprising:
- attaching a chip to a first surface of a substrate using a first solder interconnection array;
attaching an organic board to a second surface of said substrate using a second solder interconnection array thereby defining a space having a gap height between said organic board and said substrate, said second solder interconnection array residing entirely within said space;
providing an underfill material having a filler material present in an amount ranging from about 60% by weight per solution to about 64% by weight per solution, said filler material having a particle size ranging from about 32 microns to about 300 microns in diameter to fill said gap height;
depositing said underfill material within said space after said organic board has been attached to said substrate but before applying compressive forces to said electronic module, said underfill material contacting both said organic board and said substrate and selected solder joints of said second solder interconnection array; and
curing said underfill material to form a rigid matrix within said space to maintain and enhance integrity of said second solder interconnection array during application of said compressive forces.
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Accused Products
Abstract
A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.
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Citations
13 Claims
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1. A method for assembling an electronic module comprising:
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attaching a chip to a first surface of a substrate using a first solder interconnection array; attaching an organic board to a second surface of said substrate using a second solder interconnection array thereby defining a space having a gap height between said organic board and said substrate, said second solder interconnection array residing entirely within said space; providing an underfill material having a filler material present in an amount ranging from about 60% by weight per solution to about 64% by weight per solution, said filler material having a particle size ranging from about 32 microns to about 300 microns in diameter to fill said gap height; depositing said underfill material within said space after said organic board has been attached to said substrate but before applying compressive forces to said electronic module, said underfill material contacting both said organic board and said substrate and selected solder joints of said second solder interconnection array; and curing said underfill material to form a rigid matrix within said space to maintain and enhance integrity of said second solder interconnection array during application of said compressive forces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification