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Solder interconnection array with optimal mechanical integrity

  • US 7,900,809 B2
  • Filed: 06/26/2008
  • Issued: 03/08/2011
  • Est. Priority Date: 09/22/2004
  • Status: Active Grant
First Claim
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1. A method for assembling an electronic module comprising:

  • attaching a chip to a first surface of a substrate using a first solder interconnection array;

    attaching an organic board to a second surface of said substrate using a second solder interconnection array thereby defining a space having a gap height between said organic board and said substrate, said second solder interconnection array residing entirely within said space;

    providing an underfill material having a filler material present in an amount ranging from about 60% by weight per solution to about 64% by weight per solution, said filler material having a particle size ranging from about 32 microns to about 300 microns in diameter to fill said gap height;

    depositing said underfill material within said space after said organic board has been attached to said substrate but before applying compressive forces to said electronic module, said underfill material contacting both said organic board and said substrate and selected solder joints of said second solder interconnection array; and

    curing said underfill material to form a rigid matrix within said space to maintain and enhance integrity of said second solder interconnection array during application of said compressive forces.

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