Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

• US 7,901,993 B2
• Filed: 03/12/2010
• Issued: 03/08/2011
• Est. Priority Date: 03/25/2008
• Status: Expired due to Fees

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W. C., Wang, Chia-Chung
• Primary Examiner(s): Ghyka; Alexander G
• Application Number:
  US12/722,526
• Publication Number:
  US 20100167438A1
• Time in Patent Office: 361 Days
• Field of Search: 438/26, 438/118, 438/121, 438/122
• US Class Current: 438/118
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Claims

1. A method of making a semiconductor chip assembly, comprising:

providing a post, a base, an adhesive and a copper layer, wherein

the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive, is aligned with an aperture in the copper layer and is aluminum,

the base extends below the post in a downward direction opposite the upward direction, extends laterally from the post in lateral directions orthogonal to the upward and downward directions and is aluminum,

the adhesive is mounted on and extends above the base, is sandwiched between the base and the copper layer and is non-solidified, and

the copper layer is mounted on and extends above the adhesive;

then

flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer;

solidifying the adhesive;

then

providing a conductive trace that includes a pad and a terminal, wherein the conductive trace further includes a silver coating and a copper core, the silver coating is located above and overlaps the copper core, and the copper core is a selected portion of the copper layer that is coplanar with the post and the adhesive at a lateral surface that includes the post, the adhesive and the copper core and faces in the upward direction;

then

mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base and the semiconductor device is mounted on and overlaps the post;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.

2. The method of claim 1, wherein providing the post and the base includes:

providing an aluminum plate;

forming an etch mask on the aluminum plate that selectively exposes the aluminum plate;

etching the aluminum plate in a pattern defined by the etch mask, thereby forming a recess in the aluminum plate that extends into but not through the aluminum plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the aluminum plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the aluminum plate below the post and the recess.

3. The method of claim 1, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the copper layer; and

solidifying the adhesive includes curing the uncured epoxy.

4. The method of claim 1, wherein flowing the adhesive includes filling the gap with the adhesive.

5. The method of claim 1, wherein mounting the copper layer includes mounting the copper layer alone on the adhesive.

6. The method of claim 1, wherein mounting the copper layer includes mounting the copper layer and a dielectric layer on the adhesive.

7. The method of claim 1, wherein providing the pad includes removing selected portions of the copper layer after solidifying the adhesive.

9. The method of claim 1, wherein providing the conductive trace includes:

grinding the post, the adhesive and the copper layer such that the post, the adhesive and the copper layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

removing selected portions of the copper layer using an etch mask that defines the pad, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad.

10. The method of claim 1, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the post, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the post.

8. The method of claim wherein providing the pad and the terminal includes removing selected portions of the copper layer after solidifying the adhesive.

11. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions and the post and the base are aluminum;

providing an adhesive, wherein an opening extends through the adhesive;

providing a copper layer, wherein an aperture extends through the copper layer;

mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening;

mounting the copper layer on the adhesive, including aligning the post with the aperture, wherein the copper layer extends above the adhesive and the adhesive is sandwiched between the base and the copper layer and is non-solidified;

then

applying heat to melt the adhesive;

moving the base and the copper layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the copper layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the copper layer;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the copper layer;

then

providing a conductive trace that includes a pad and a terminal, wherein the conductive trace further includes a silver coating and a copper core, the silver coating is located above and overlaps the copper core, the copper core is a selected portion of the copper layer that is coplanar with the post and the adhesive at a lateral surface that faces in the upward direction, the silver coating and the copper core provide portions of the pad and the pad is electrically connected to the terminal;

then

mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base and the semiconductor device overlaps the post;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.

12. The method of claim 11, wherein providing the post and the base includes:

providing an aluminum plate;

forming an etch mask on the aluminum plate that selectively exposes the aluminum plate;

etching the aluminum plate in a pattern defined by the etch mask, thereby forming a recess in the aluminum plate that extends into but not through the aluminum plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the aluminum plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the aluminum plate below the post and the recess.

13. The method of claim 11, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the copper layer; and

solidifying the adhesive includes curing the uncured epoxy.

14. The method of claim 11, wherein mounting the copper layer includes mounting the copper layer alone on the adhesive.

15. The method of claim 11, wherein mounting the copper layer includes mounting the copper layer and a dielectric layer on the adhesive.

16. The method of claim 11, wherein providing the pad includes:

removing selected portions of the copper layer using an etch mask that defines the pad, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad.

17. The method of claim 11, wherein providing the pad includes:

grinding the post, the adhesive and the copper layer such that the post, the adhesive and the copper layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

removing selected portions of the copper layer using an etch mask that defines the pad, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad.

18. The method of claim 17, wherein plating the silver coating includes plating the silver coating on the copper core.

19. The method of claim 17, wherein plating the silver coating includes:

plating a nickel buffer layer on the copper core; and

plating the silver coating on the nickel buffer layer.

20. The method of claim 11, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the post, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the post.

21. A method of making a semiconductor chip assembly, comprising:

providing a post, a base, an adhesive and a substrate, wherein

the substrate includes a copper layer and a dielectric layer,

the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive, extends into an aperture in the substrate and is aluminum,

the base extends below the post in a downward direction opposite the upward direction, extends laterally from the post in lateral directions orthogonal to the upward and downward directions and is aluminum,

the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified,

the substrate is mounted on and extends above the adhesive, and the copper layer extends above the dielectric layer, and

a gap is located in the aperture between the post and the substrate;

then

flowing the adhesive into and upward in the gap;

solidifying the adhesive;

then

mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, the semiconductor device overlaps the post, a conductive trace includes a pad and a terminal and further includes a silver coating and a copper core, the silver coating is located above and overlaps the copper core, the copper core is a selected portion of the copper layer that is coplanar with the post and the adhesive at a lateral surface that faces in the upward direction, the silver coating and the copper core provide portions of the pad and the pad is electrically connected to the terminal;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.

22. The method of claim 21, wherein providing the post and the base includes:

providing an aluminum plate;

forming an etch mask on the aluminum plate that selectively exposes the aluminum plate;

etching the aluminum plate in a pattern defined by the etch mask, thereby forming a recess in the aluminum plate that extends into but not through the aluminum plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the aluminum plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the aluminum plate below the post and the recess.

23. The method of claim 21, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the substrate; and

solidifying the adhesive includes curing the uncured epoxy.

24. The method of claim 21, wherein flowing the adhesive includes filling the gap with the adhesive.

25. The method of claim 21, wherein providing the pad includes:

removing selected portions of the copper layer after solidifying the adhesive, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad.

26. The method of claim 21, wherein providing the pad and the terminal includes:

removing selected portions of the copper layer after solidifying the adhesive, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad and the terminal.

27. The method of claim 21, wherein providing the pad and the terminal includes:

grinding the post, the adhesive and the copper layer such that the post, the adhesive and the copper layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

removing selected portions of the copper layer using an etch mask that defines the pad and the terminal, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad and the terminal.

28. The method of claim 21, wherein providing the terminal includes removing selected portions of the base after solidifying the adhesive.

29. The method of claim 21, wherein providing the conductive trace includes:

grinding the post, the adhesive and the copper layer such that the post, the adhesive and the copper layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

removing selected portions of the copper layer using an etch mask that defines the pad, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad.

30. The method of claim 21, wherein mounting the semiconductor device includes mounting an LED chip on the post using a die attach, electrically connecting the semiconductor device includes providing a wire bond between the LED chip and the pad, and thermally connecting the semiconductor device includes providing the die attach between the LED chip and the post.

31. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions and the post and the base are aluminum;

providing an adhesive, wherein an opening extends through the adhesive;

providing a substrate that includes a copper layer and a dielectric layer, wherein an aperture extends through the substrate;

mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;

mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the copper layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;

then

applying heat to melt the adhesive;

moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;

then

mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, the semiconductor device overlaps the post, a conductive trace includes a pad and a terminal and further includes a silver coating and a copper core, the silver coating is located above and overlaps the copper core, the copper core is a selected portion of the copper layer that is coplanar with the post and the adhesive at a lateral surface that faces in the upward direction, the silver coating and the copper core provide portions of the pad and the pad is electrically connected to the terminal;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.

32. The method of claim 31, wherein providing the post and the base includes:

providing an aluminum plate;

forming an etch mask on the aluminum plate that selectively exposes the aluminum plate;

etching the aluminum plate in a pattern defined by the etch mask, thereby forming a recess in the aluminum plate that extends into but not through the aluminum plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the aluminum plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the aluminum plate below the post and the recess.

33. The method of claim 31, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the substrate; and

solidifying the adhesive includes curing the uncured epoxy.

34. The method of claim 31, wherein providing the pad and the terminal includes:

removing selected portions of the copper layer using an etch mask that defines the pad and the terminal after solidifying the adhesive, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad and the terminal.

35. The method of claim 31, wherein providing the pad and the terminal includes:

grinding the post, the adhesive and the copper layer such that the post, the adhesive and the copper layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

removing selected portions of the copper layer using an etch mask that defines the pad and the terminal, thereby forming the copper core; and

then

plating the silver coating over the copper core, thereby forming the pad and the terminal.