Method of forming a layer to enhance ALD nucleation on a substrate

• US 7,902,064 B1
• Filed: 05/15/2008
• Issued: 03/08/2011
• Est. Priority Date: 05/16/2007
• Status: Active Grant

• Current Assignee: Intermolecular Incorporated
• Original Assignee: Intermolecular Incorporated
• Inventors: Fresco, Zachary, Chiang, Tony, Lang, Chi-I
• Primary Examiner(s): Le; Thao X
• Assistant Examiner(s): Kraig; William F
• Application Number:
  US12/121,661
• Time in Patent Office: 1,027 Days
• Field of Search: 257/751, 257/738, 257/758, 257/759, 257/635, 257/E23.165, 438/627, 438/638, 438/653
• US Class Current: 438/627
• CPC Class Codes: C23C 16/0272 Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76807 for dual damascene structures
• CPC Class Codes: H01L 21/76814 post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76876 for deposition from the gas phase, e.g. CVD

Abstract

A layer to enhance nucleation of a substrate is described, including a method to form the layer, the method including obtaining a substrate comprising a patterned feature comprising a dielectric region and a conductive region, selectively forming a self-aligned monolayer (SAM) on the dielectric region of the substrate to enhance nucleation process of a first precursor, and depositing the first precursor on the substrate, the precursor to adsorb on the SAM.

Claims

1. A method, comprising:

obtaining a substrate comprising a patterned feature, the patterned feature comprising a dielectric region and a conductive region;

depositing a PVA solution having a concentration of between 20 and 500 mM with respect to monomer units on the substrate to selectively form a self-aligned monolayer (SAM) on the dielectric region of the substrate to enhance a nucleation process of a first precursor;

introducing the first precursor to the substrate, the precursor to adsorb on the SAM.

2. The method of claim 1, further comprising introducing a second precursor on the substrate to react with the adsorbed first precursor to form a layer on the substrate.

3. The method of claim 1, wherein introducing the first precursor comprises introducing a first atomic layer deposition (ALD) precursor.

4. The method of claim 1, wherein depositing the PVA solution on the substrate changes a hydrophobic characteristic of the substrate to a hydrophilic characteristic of the substrate to functionalize the substrate for the adsorbing the first precursor.

5. The method of claim 1, wherein obtaining the substrate comprises obtaining the substrate comprising a damascene patterned feature.

6. The method of claim 1, wherein obtaining the substrate comprises:

obtaining the substrate comprising a dual damascene patterned feature, wherein the dual damascene patterned feature comprises a first dielectric layer having a via and a second dielectric layer having a trench over the first dielectric layer.

7. The method of claim 6, wherein the first dielectric layer and the second dielectric layer are chosen from the group consisting of silicon dioxide, fluorosilicate glass (FSG), silicon oxycarbide (SiCOH), silicon nitride (SiN), silicon carbon nitride (SiCN), silicon carbide (SiC), low-k dielectrics and porous low-k dielectrics.

8. The method of claim 1, wherein the first precursor is an organometallic.

9. The method of claim 1, further comprising thermally treating the substrate after depositing the PVA solution and before introducing the first precursor.

10. A method comprising:

obtaining a substrate comprising a dielectric region and a conductive region;

patterning the dielectric regions of the substrate to form a patterned feature;

depositing a PVA solution having a concentration of between 20 and 500 mM with respect to monomer units on the substrate to selectively form a self-aligned monolayer (SAM) on the dielectric regions of the substrate and the patterned feature; and

performing a reactive pre-clean of the substrate.

11. The method of claim 10, wherein performing the reactive pre-clean comprises performing a reactive plasma clean.

12. The method of claim 10, wherein the SAM protects the dielectric region during the reactive pre-clean.

13. The method of claim 10, further comprising depositing a barrier layer on the substrate after the reactive pre-clean.

14. The method of claim 13, further comprising depositing a seed layer over the barrier layer.