Composition of cationic initiator and oxetane compound

• US 7,902,305 B2
• Filed: 06/26/2008
• Issued: 03/08/2011
• Est. Priority Date: 04/04/2005
• Status: Expired due to Fees

• Current Assignee: Henkel AG & Co KGaA
• Original Assignee: Henkel AG & Co KGaA
• Inventors: Kong, Shengqian
• Primary Examiner(s): SELLERS, ROBERT E
• Application Number:
  US12/147,032
• Publication Number:
  US 20080272328A1
• Time in Patent Office: 985 Days
• Field of Search: None
• US Class Current: 525/523
• CPC Class Codes: C08G 65/18 Oxetanes
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021

Abstract

This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.

Claims

1. A cationically curable barrier composition consisting essentially of

(a) an oxetane compound;

(b) a cationic initiator,

(c) one or more fillers, and

(d) one or more adhesion promoters, or one or more epoxy resins;

wherein said oxetane compound has the structure;

2. The cationically curable barrier composition in accordance with claim 1, wherein the cationic initiator is the cationically curable barrier composition in accordance with claim 1, wherein the cationic initiator is selected from the group consisting of diaryliodonium salts, triarylsulfonium salts benzylsulfonium salts, phenacylsulfonium salts, N-benzylpyridinium salts, N-benzylpryazinium salts, N-benzylammonium salts, phosphonium salts, hydrazinium salts, and ammonium borate salts.

3. The cationically curable barrier composition in accordance with claim 2, wherein the cationic initiator is selected from the group consisting of diaryliodonium salts and triarylsulfonium salts.

4. The cationically curable barrier composition in accordance with claim 1 in which one or more fillers are present and are selected from the group consisting of ground quartz, fused silica, amorphous silica, talc, glass beads, graphite, carbon black, alumina, clays, mica, vermiculite, aluminum nitride, boron nitride;

silver, copper, gold, tin, tin/lead alloys, poly(tetrachloroethylene), poly(chlorotriflouroethylene), poly(vinylidene chloride), CaO, BaO, Na₂SO₄, CaSO₄, MgSO₄, zeolites, silica gel, P₂O₅, CaCl₂, and Al₂O₃.

5. The cationically curable barrier composition in accordance of claim 1 in which adhesion promoter is not present, and one or more epoxy resins are present and are selected from the group consisting of bisphenol F diglycidyl ether, resorcinol diglycidyl ether, novolac glycidyl ethers, and halogenated glycidyl ethers.

6. The cationically curable barrier composition in accordance with claim 1 in which epoxy resin is not present, and one or more adhesion promoters are present and the promoter is a silane.