Inspection method and inspection apparatus

• US 7,902,845 B2
• Filed: 05/08/2009
• Issued: 03/08/2011
• Est. Priority Date: 03/19/2001
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Hiroki, Masaaki
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Nguyen; Trung Q
• Application Number:
  US12/437,708
• Publication Number:
  US 20090212792A1
• Time in Patent Office: 669 Days
• Field of Search: 324/158.1, 324750-758, 324760-765, 324/770, 438/14, 438/17, 438/18
• US Class Current: 324/750.15
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/315 by inductive methods
• CPC Class Codes: G09G 3/006 Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309

Abstract

There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot.

Claims

1. A semiconductor device comprising:

a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;

a second circuit comprising a resistor and a capacitor, wherein the second circuit is electrically connected to the first circuit and formed on the substrate;

a coil for receiving an AC signal, wherein the coil is electrically connected to the second circuit and formed on the substrate; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the first circuit, and

wherein the connecting terminal is connectable to an external power supply.

2. A device according to claim 1,

wherein an AC voltage is generated between two terminals of the coil by electromagnetic induction, and

wherein the AC voltage is shaped by the second circuit to form a driving signal, and then, supplied to the first circuit.

3. A device according to claim 1, wherein the first circuit comprises a shift register, a level shifter and an analog switch.

4. A device according to claim 1, wherein the substrate has an insulating surface.

5. The semiconductor device according to claim 1 is a display device.

6. A semiconductor device comprising:

a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;

a second circuit comprising a diode, a capacitor and a resistor, wherein the second circuit is electrically connected to the first circuit and formed on the substrate;

a coil for receiving an AC signal, wherein the coil is electrically connected to the second circuit and formed on the substrate; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the first circuit, and

wherein the connecting terminal is connectable to an external power supply.

7. A device according to claim 6,

wherein an AC voltage is generated between two terminals of the coil by electromagnetic induction, and

wherein the AC voltage is rectified by the second circuit to form a power supply voltage, and then, supplied to the first circuit.

8. A device according to claim 6, wherein the first circuit comprises a shift register, a level shifter and an analog switch.

9. A device according to claim 6, wherein the substrate has an insulating surface.

10. The semiconductor device according to claim 6 is a display device.

11. A semiconductor device comprising:

a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate;

a coil for receiving an AC signal;

a rectifier circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the driving circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the rectifier circuit, and

wherein the driving circuit outputs information when the driving circuit is driven by the driving signal.

12. The semiconductor device according to claim 11, wherein the coil receives an AC signal in a non-contact manner.

13. The semiconductor device according to claim 11 is a display device.

14. A semiconductor device comprising:

a circuit comprising a thin film transistor, wherein the circuit is formed on a substrate;

a coil for receiving an AC voltage; and

a rectifier circuit formed on the substrate for supplying a power supply voltage into the circuit in accordance with the AC voltage; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the rectifier circuit, and

wherein the circuit outputs information when the circuit is driven by the power supply voltage.

15. The semiconductor device according to claim 14, wherein the coil receives an AC voltage in a non-contact manner.

16. The semiconductor device according to claim 14 is a display device.

17. A semiconductor device comprising:

a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate;

a coil for receiving an AC signal;

a rectifier circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the driving circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the rectifier circuit, and

wherein the driving circuit outputs an electromagnetic wave when the driving circuit is driven by the driving signal.

18. The semiconductor device according to claim 17, wherein the coil receives an AC signal in a non-contact manner.

19. The semiconductor device according to claim 17 is a display device.

20. A semiconductor device comprising:

a circuit comprising a thin film transistor, wherein the circuit is formed on a substrate;

a coil for receiving an AC voltage;

a rectifier circuit fowled on the substrate for supplying a power supply voltage into the circuit in accordance with the AC voltage; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the rectifier circuit, and

wherein the circuit outputs an electromagnetic wave when the circuit is driven by the power supply voltage.

21. The semiconductor device according to claim 20, wherein the coil receives an AC voltage in a non-contact manner.

22. The semiconductor device according to claim 20 is a display device.

23. A semiconductor device comprising:

a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate;

a coil for receiving an AC signal;

a circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the driving circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the circuit, and

wherein the driving circuit outputs information when the driving circuit is driven by the driving signal.

24. The semiconductor device according to claim 23, wherein the coil receives an AC signal in a non-contact manner.

25. The semiconductor device according to claim 23 is a display device.

26. A semiconductor device comprising:

a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;

substrate;

a coil for receiving an AC voltage;

a second circuit formed on the substrate for supplying a power supply voltage into the first circuit in accordance with the AC voltage; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the first circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the second circuit, and

wherein the first circuit outputs information when the first circuit is driven by the power supply voltage.

27. The semiconductor device according to claim 26, wherein the coil receives an AC voltage in a non-contact manner.

28. The semiconductor device according to claim 26 is a display device.

29. A semiconductor device comprising:

a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate;

a coil for receiving an AC signal;

a circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the driving circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the circuit, and

wherein the driving circuit outputs an electromagnetic wave when the driving circuit is driven by the driving signal.

30. The semiconductor device according to claim 29, wherein the coil receives an AC signal in a non-contact manner.

31. The semiconductor device according to claim 29 is a display device.

32. A semiconductor device comprising:

a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;

a coil for receiving an AC voltage;

a second circuit formed on the substrate for supplying a power supply voltage into the first circuit in accordance with the AC voltage; and

a connecting terminal formed on the substrate,

wherein the connecting terminal is electrically connected to the first circuit,

wherein the connecting terminal is connectable to an external power supply,

wherein the coil is electrically connected to the second circuit, and

wherein the first circuit outputs an electromagnetic wave when the first circuit is driven by the power supply voltage.

33. The semiconductor device according to claim 32, wherein the coil receives an AC voltage in a non-contact manner.

34. The semiconductor device according to claim 32 is a display device.