Inspection method and inspection apparatus
First Claim
1. A semiconductor device comprising:
- a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;
a second circuit comprising a resistor and a capacitor, wherein the second circuit is electrically connected to the first circuit and formed on the substrate;
a coil for receiving an AC signal, wherein the coil is electrically connected to the second circuit and formed on the substrate; and
a connecting terminal formed on the substrate,wherein the connecting terminal is electrically connected to the first circuit, andwherein the connecting terminal is connectable to an external power supply.
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Accused Products
Abstract
There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot.
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Citations
34 Claims
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1. A semiconductor device comprising:
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a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate; a second circuit comprising a resistor and a capacitor, wherein the second circuit is electrically connected to the first circuit and formed on the substrate; a coil for receiving an AC signal, wherein the coil is electrically connected to the second circuit and formed on the substrate; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the first circuit, and wherein the connecting terminal is connectable to an external power supply. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate; a second circuit comprising a diode, a capacitor and a resistor, wherein the second circuit is electrically connected to the first circuit and formed on the substrate; a coil for receiving an AC signal, wherein the coil is electrically connected to the second circuit and formed on the substrate; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the first circuit, and wherein the connecting terminal is connectable to an external power supply. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor device comprising:
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a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate; a coil for receiving an AC signal; a rectifier circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the driving circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the rectifier circuit, and wherein the driving circuit outputs information when the driving circuit is driven by the driving signal. - View Dependent Claims (12, 13)
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14. A semiconductor device comprising:
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a circuit comprising a thin film transistor, wherein the circuit is formed on a substrate; a coil for receiving an AC voltage; and a rectifier circuit formed on the substrate for supplying a power supply voltage into the circuit in accordance with the AC voltage; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the rectifier circuit, and wherein the circuit outputs information when the circuit is driven by the power supply voltage. - View Dependent Claims (15, 16)
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17. A semiconductor device comprising:
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a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate; a coil for receiving an AC signal; a rectifier circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the driving circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the rectifier circuit, and wherein the driving circuit outputs an electromagnetic wave when the driving circuit is driven by the driving signal. - View Dependent Claims (18, 19)
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20. A semiconductor device comprising:
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a circuit comprising a thin film transistor, wherein the circuit is formed on a substrate; a coil for receiving an AC voltage; a rectifier circuit fowled on the substrate for supplying a power supply voltage into the circuit in accordance with the AC voltage; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the rectifier circuit, and wherein the circuit outputs an electromagnetic wave when the circuit is driven by the power supply voltage. - View Dependent Claims (21, 22)
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23. A semiconductor device comprising:
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a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate; a coil for receiving an AC signal; a circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the driving circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the circuit, and wherein the driving circuit outputs information when the driving circuit is driven by the driving signal. - View Dependent Claims (24, 25)
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26. A semiconductor device comprising:
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a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate;
substrate;a coil for receiving an AC voltage; a second circuit formed on the substrate for supplying a power supply voltage into the first circuit in accordance with the AC voltage; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the first circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the second circuit, and wherein the first circuit outputs information when the first circuit is driven by the power supply voltage. - View Dependent Claims (27, 28)
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29. A semiconductor device comprising:
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a driving circuit comprising a thin film transistor, wherein the driving circuit is formed on a substrate; a coil for receiving an AC signal; a circuit formed on the substrate for supplying a driving signal into the driving circuit in accordance with the AC signal; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the driving circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the circuit, and wherein the driving circuit outputs an electromagnetic wave when the driving circuit is driven by the driving signal. - View Dependent Claims (30, 31)
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32. A semiconductor device comprising:
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a first circuit comprising a thin film transistor, wherein the first circuit is formed on a substrate; a coil for receiving an AC voltage; a second circuit formed on the substrate for supplying a power supply voltage into the first circuit in accordance with the AC voltage; and a connecting terminal formed on the substrate, wherein the connecting terminal is electrically connected to the first circuit, wherein the connecting terminal is connectable to an external power supply, wherein the coil is electrically connected to the second circuit, and wherein the first circuit outputs an electromagnetic wave when the first circuit is driven by the power supply voltage. - View Dependent Claims (33, 34)
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Specification