Hermeticity testing
First Claim
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1. An electrical circuit apparatus comprising:
- a first portion comprising a first chain-structure portion of a testing structure, the first portion comprising;
a substantially-planar connection surface,a substrate provided from a wafer, andone or more chain-structure segments forming at least a part of the first chain-structure portion, each chain-structure segment comprising;
two connection pads exposed at the connection surface, andan electrical interconnect electrically coupling the two connection pads;
a second portion comprising a second chain-structure portion of the testing structure, the second portion comprising;
a substantially-planar connection surface,a substrate provided from a wafer, andone or more chain-structure segments forming at least a part of the second chain-structure portion, each chain-structure segment comprising;
two connection pads exposed at the connection surface, andan electrical interconnect electrically coupling the two connection pads; and
one or more circuit devices comprising electrical circuitry, wherein the one or more circuit devices are located in one or more hermetically-sealed regions,wherein the connection surface of the first portion is bonded to the connection surface of the second portion, wherein each connection pad of one or more chain-structure segments of the first portion is electrically coupled to a connection pad of the one or more chain-structure segments of the second portion to form the testing structure, wherein the testing structure comprises at least one series circuit extending from a first end to a second end around the one or more hermetically-sealed regions and formed at an interface of the connection surface of the first portion and the connection surface of the second portion.
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Abstract
Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
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Citations
20 Claims
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1. An electrical circuit apparatus comprising:
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a first portion comprising a first chain-structure portion of a testing structure, the first portion comprising; a substantially-planar connection surface, a substrate provided from a wafer, and one or more chain-structure segments forming at least a part of the first chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads; a second portion comprising a second chain-structure portion of the testing structure, the second portion comprising; a substantially-planar connection surface, a substrate provided from a wafer, and one or more chain-structure segments forming at least a part of the second chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads; and one or more circuit devices comprising electrical circuitry, wherein the one or more circuit devices are located in one or more hermetically-sealed regions, wherein the connection surface of the first portion is bonded to the connection surface of the second portion, wherein each connection pad of one or more chain-structure segments of the first portion is electrically coupled to a connection pad of the one or more chain-structure segments of the second portion to form the testing structure, wherein the testing structure comprises at least one series circuit extending from a first end to a second end around the one or more hermetically-sealed regions and formed at an interface of the connection surface of the first portion and the connection surface of the second portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming an electrical circuit apparatus, wherein the method comprises:
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providing a first portion comprising a first chain-structure portion of a testing structure and a substantially-planar connection surface, wherein providing the first portion comprises; providing a substrate provided from a wafer, and providing one or more chain-structure segments, wherein the one or more chain-structure segments faun at least a part of the first chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads; providing a second portion comprising a second chain-structure portion of the testing structure and a substantially-planar connection surface, wherein providing the second portion comprises; providing a substrate provided from a wafer, and providing one or more chain-structure segments, wherein the one or more chain-structure segments form at least a part of the second chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads; providing one or more circuit devices comprising electrical circuitry, wherein the one or more circuit devices are located in one or more hermetically-sealed regions; and bonding the connection surface of the first portion to the connection surface of the second portion, wherein each connection pad of one or more chain-structure segments of the first portion is electrically coupled to a connection pad of the one or more chain-structure segments of the second portion to form the testing structure, wherein the testing structure comprises at least one series circuit extending from a first end to a second end around the one or more hermetically-sealed regions and formed at an interface of the connection surface of the first portion and the connection surface of the second portion. - View Dependent Claims (11, 12, 13, 14)
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15. A method of testing an electrical circuit apparatus, wherein the method comprises:
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providing an electrical circuit apparatus comprising; a first portion comprising a first chain-structure portion of a testing structure, the first portion comprising; a substantially-planar connection surface, a substrate provided from a wafer, and one or more chain-structure segments forming at least a part of the first chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads, a second portion comprising a second chain-structure portion of the testing structure, the second portion comprising; a substantially-planar connection surface, a substrate provided from a wafer, and one or more chain-structure segments forming at least a part of the second chain-structure portion, each chain-structure segment comprising; two connection pads exposed at the connection surface, and an electrical interconnect electrically coupling the two connection pads, and one or more circuit devices comprising electrical circuitry formed, wherein the one or more circuit devices define one or more hermetically-sealed regions, wherein the connection surface of the first portion is bonded to the connection surface of the second portion, wherein each connection pad of one or more chain-structure segments of the first portion is electrically coupled to a connection pad of the one or more chain-structure segments of the second portion to form the testing structure, wherein the testing structure comprises at least one series circuit extending from a first end to a second end around the one or more hermetically-sealed regions and formed at an interface of the connection surface of the first portion and the connection surface of the second portion; and testing the at least one series circuit of the testing structure to confirm or validate hermeticity about the one or more hermetically-sealed areas. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification