Phase change cooled electrical resistor

• US 7,902,957 B2
• Filed: 04/30/2007
• Issued: 03/08/2011
• Est. Priority Date: 04/30/2007
• Status: Expired due to Fees

• Current Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Gollhardt, Neil, Weiss, Bruce W., Brubaker, John R., Radosevich, Lawrence D., Grosskreuz, Paul J., Lukaszewski, Richard A.
• Primary Examiner(s): LEE, KYUNG S
• Application Number:
  US11/796,822
• Publication Number:
  US 20080266046A1
• Time in Patent Office: 1,408 Days
• Field of Search: 338/51, 338/59, 338/53, 338/332, 338/322, 338/327, 338/219, 361700-703
• US Class Current: 338/53
• CPC Class Codes: H01C 1/028 the resistive element being embedded in insulation with outer enclosing sheath
• CPC Class Codes: H01C 1/082 using forced fluid flow
• CPC Class Codes: H01C 1/084 using self-cooling, e.g. fins, heat sinks

Abstract

A technique is disclosed for cooling resistive elements, such as brake resistors used in motor drives, as well as other resistors. A phase change heat spreader is thermally coupled to the resistive element and a continuous phase change cycle takes place in the heat spreader to extract heat from the resistive element. The element and heat spreader may be packaged as a modular unit or may be integrated into a system.

Claims

1. An electrical resistor assembly comprising:

an electrical resistor; and

a phase change heat spreader disposed adjacent to the resistor and configured to draw heat from the resistor during operation via phase changes in a cooling medium within the phase change heat spreader.

2. The electrical resistor assembly of claim 1, wherein the resistor is disposed in an enclosure and thermally coupled to the phase change heat spreader through a base of the enclosure.

3. The electrical resistor assembly of claim 2, wherein base of the enclosure forms part of the phase change heat spreader.

4. The electrical resistor assembly of claim 2, wherein the resistor includes leads extending through a side of the enclosure.

5. The electrical resistor assembly of claim 1, wherein the resistor is generally planar and extends generally parallel to the phase change heat spreader.

6. The electrical resistor assembly of claim 1, wherein the phase change heat spreader includes a generally planar evaporator side adjacent to the resistor, a wick structure for channeling condensate to the evaporator side, a generally planar condenser side opposite the evaporator side, and the cooling medium sealed between the evaporator side and the condenser side at a partial pressure that permits evaporation and condensation of the cooling medium during operation.

7. The electrical resistor assembly of claim 6, wherein the wick structure includes a primary wick structure disposed adjacent to the evaporator side and a secondary wick structure extending from the condenser side to the primary wick structure for wicking the cooling medium from the condenser to the primary wick structure.

8. The electrical resistor assembly of claim 1, comprising a heat dissipating structure thermally coupled to the phase change heat spreader to dissipate heat transferred to the heat spreader during operation.

9. A method for making an electrical resistor assembly comprising:

disposing an electrical resistor in an enclosure; and

disposing a phase change heat spreader adjacent to the enclosure, the phase change heat spreader being configured to draw heat from the resistor during operation via phase changes in a cooling medium within the phase change heat spreader.

10. The method of claim 9, comprising extending leads from the resistor through a side of the enclosure.

11. The method of claim 9, comprising disposing a dielectric material between the resistor and the phase change heat spreader.

12. The method of claim 9, wherein the resistor and the phase change heat spreader are generally planar, and the phase change heat spreader is disposed generally parallel to the resistor.

13. The method of claim 9, comprising at least partially filing the enclosure with a potting material to cover the resistor.