Probing system for integrated circuit devices

• US 7,904,768 B2
• Filed: 05/03/2008
• Issued: 03/08/2011
• Est. Priority Date: 05/04/2005
• Status: Active Grant

• Current Assignee: National Tsing Hua University
• Original Assignee: National Tsing Hua University
• Inventors: Huang, Chih-Tsun, Hsing, Yu-Tsao, Wu, Cheng-Wen
• Primary Examiner(s): Trimmings; John P
• Application Number:
  US12/114,768
• Publication Number:
  US 20080209293A1
• Time in Patent Office: 1,039 Days
• Field of Search: None
• US Class Current: 714/724
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: H04B 17/0085 using test signal generators

Abstract

A probing system for an integrated circuit device, which transmits a testing data/signal between an automatic test equipment (ATE) and an integrated circuit device, is disclosed. The probing system includes a test head having a first transceiving module. There is a test station having a test unit coupled to the test head to perform a test operation. A communication module has a second transceiving module configured to exchange data with the first transceiving module in a wireless manner. There is an integrated circuit device having a core circuit being tested, and a test module having a self-test circuit coupled to the core circuit and the communication module for performing the core circuit self-testing.

Claims

1. A probing system for integrated circuit device, comprising:

a test head having a first transceiving module;

a test station having a test unit coupled to the test head to perform a test operation;

a communication module having a second transceiving module configured to exchange data with the first transceiving module in a wireless manner;

an integrated circuit device having a core circuit being tested; and

a test module having a self-test circuit coupled to the core circuit and the communication module for performing self-testing to the core circuit.

2. The probing system for integrated circuit device of claim 1, wherein the integrated circuit device further comprises a tag register to store an identification.

3. The probing system for integrated circuit device of claim 1, further comprising:

a clock generator coupled to the second transceiving module.

4. The probing system for integrated circuit device of claim 3, wherein the communication module further comprises a communication controller coupled to the second transceiving module and the clock generator.

5. The probing system for integrated circuit device of claim 3, wherein the clock generator is coupled to the test module.

6. The probing system for integrated circuit device of claim 3, wherein the integrated circuit device comprises the clock generator.

7. The probing system for integrated circuit device of claim 1, further comprising:

a power regulator coupled to the communication module, test module and the integrated circuit device, the test unit initiating the transmission of a radio frequency signal by the first transceiving module, the second transceiving module receiving the radio frequency signal to drive the power regulator to generate operation power for the integrated circuit device.

8. The probing system for integrated circuit device of claim 1, further comprising:

a conveying device, and the integrated circuit device being transported to a predetermined position by the conveying device.

9. The probing system for integrated circuit device of claim 1, wherein the test head further comprises a physical layer module coupled to the first transceiving module.

10. The probing system for integrated circuit device of claim 1, wherein the test station further comprises a diagnosis unit coupled to the testing unit.

11. The probing system for integrated circuit device of claim 1, wherein the core circuit comprises a memory circuit and wherein the test module comprises a memory self-test circuit.

12. The probing system for integrated circuit device of claim 1, wherein the core module comprises a logic circuit and the test module comprises a logic self-test circuit.

13. The probing system for integrated circuit device of claim 1, wherein the core module comprises an analog circuit and the test module comprises an analog self-test circuit.

14. The probing system for the integrated circuit device of claim 1, further comprising:

at least one test head;

a plurality of communication modules capable of communicating with the at least one test head in a wireless manner;

a plurality of test modules coupled to the plurality of communication modules individually; and

a plurality of integrated circuit devices, each of the integrated circuit device having a core circuit and the core circuit of the plurality of integrated circuit devices being individually coupled to the plurality of test modules.

15. The probing system for integrated circuit device of claim 14, wherein one test head communicates with one or more communication modules.

16. The probing system for integrated circuit device of claim 7, wherein the integrated circuit device comprises the power regulator.

17. The probing system for integrated circuit device of claim 7, wherein the integrated circuit device is positioned on a loader having the power regulator, acquiring operation power from the loader.

18. The probing system for integrated circuit device of claim 17, wherein the integrated circuit device comprises the communication module and the test module.

19. The probing system for integrated circuit device of claim 17, wherein the loader comprises the communication module.

20. The probing system for integrated circuit device of claim 19, wherein the loader comprises the test module.

21. The probing system for integrated circuit device of claim 19, wherein the integrated circuit device comprises the test module.