Camera printhead assembly with baffles to retard ink acceleration

• US 7,905,588 B2
• Filed: 09/15/2008
• Issued: 03/15/2011
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Nguyen; Lamson D
• Application Number:
  US12/211,003
• Publication Number:
  US 20090002470A1
• Time in Patent Office: 911 Days
• Field of Search: 347/93, 347/108, 347 84- 85
• US Class Current: 347/93
• CPC Class Codes: B05D 2201/00 Polymeric substrate or laminate
• CPC Class Codes: B05D 3/08 by flames
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04571 detecting viscosity
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 : dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 : sacrificial molding
• CPC Class Codes: B41J 2/1642 : thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14419 : Manifold
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: Y10T 29/49345 : Catalytic device making

Abstract

A printhead assembly is provided for a print-on-demand camera system. The printhead assembly includes an ink ejection printhead integrated circuit (IC). An ink distribution molding is provided to which the IC is mounted, and though which ink is distributed to the IC. A filter covers the ink distribution molding to filter ink passing to the ink distribution molding. A baffle unit is provided in which the ink distribution molding and filter is received, and includes spaced apart baffles to retard ink acceleration. A housing is provided in which the baffle unit is housed.

Claims

1. A printhead assembly for a print-on-demand camera system, the printhead assembly comprising:

at least one ink ejection printhead integrated circuit (IC);

an ink distribution molding to which the IC is mounted and though which ink is distributed to the IC;

a filter covering the ink distribution molding to filter ink passing to the ink distribution molding;

a baffle unit in which the ink distribution molding and filter is received and including spaced apart baffles to retard ink acceleration; and

a housing in which the baffle unit is housed.

2. A printhead assembly as claimed in claim 1, wherein the IC includes a plurality of inlets in fluid communication with outlets of the ink distribution molding about engaged ink port surfaces, and the IC is adhered to the ink distribution molding about surfaces other than said ink port surfaces.

3. A printhead assembly as claimed in claim 1, wherein the baffle unit is plastic injection molded and the filter is adhered within the baffle unit.

4. A printhead assembly as claimed in claim 3, wherein the housing is ultrasonically welded to the baffle unit.

5. A printhead assembly as claimed in claim 1, wherein the baffle unit further includes a series of pierceable end wall portions which can be pierced by a corresponding mating ink supply conduit for the flow of ink into respective internal chambers.

6. A printhead assembly as claimed in claim 5, wherein the housing includes a series of holes which are hydrophobically sealed so as to allow air within the chambers of the baffle unit to escape whilst ink remains within the internal chambers.

7. A printhead assembly as claimed in claim 1, wherein the housing defines a series of positioning protuberances configured to position tape automated bonded (TAB) film connected to the IC, and power and ground busbars which are interconnected to the TAB film at plurality of locations along the TAB film.