Electronic device connecting structure and function expansion device
First Claim
Patent Images
1. A connecting structure of a second electronic device, the connecting structure comprising:
- a second electromagnetic interference (EMI) shield;
a second signal line enclosed by the second EMI shield and connected to a first signal line when hot docking with a first electronic device comprising a first EMI shield, a processor enclosed by the first EMI shield, the first signal line enclosed by the first EMI shield and connected to the processor, and a first signal earth line enclosed by the first EMI shield and connected to the processor;
a second signal earth line enclosed by the second EMI shield and connected to the first signal earth line when hot docking;
an EMI connecting portion connected to the second EMI shield and comprising a good conductor connected to the first EMI shield when hot docking; and
an electrostatic discharge (ESD) contact portion comprising conductive rubber formed outside of the EMI connecting portion and co-axial with the EMI connecting portion, connected to the second EMI shield, higher in impedance than the EMI connecting portion, and coming in contact with the first EMI shield earlier than the EMI connecting portion at the time of hot docking and withdrawing to expose the EMI connecting portion in response to the ESD contact portion being pressed against the first EMI shield such that the EMI connecting portion comes in contact with the first EMI shield.
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0 Petitions
Accused Products
Abstract
A connecting structure reduces noise effects on an electronic device when hot docking the electronic device to mitigate against malfunctions. When a first electronic device having a first EMI shield is docked with a second electronic device having a second EMI shield, an ESD contact portion, which is connected to the second EMI shield and has higher in impedance than an EMI connecting portion, comes in contact with the first EMI shield earlier than the EMI connecting portion. Electrostatic charge carried on the first EMI shield moves slowly to the second EMI shield due to the high impedance of the ESD contact portion.
10 Citations
10 Claims
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1. A connecting structure of a second electronic device, the connecting structure comprising:
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a second electromagnetic interference (EMI) shield; a second signal line enclosed by the second EMI shield and connected to a first signal line when hot docking with a first electronic device comprising a first EMI shield, a processor enclosed by the first EMI shield, the first signal line enclosed by the first EMI shield and connected to the processor, and a first signal earth line enclosed by the first EMI shield and connected to the processor; a second signal earth line enclosed by the second EMI shield and connected to the first signal earth line when hot docking; an EMI connecting portion connected to the second EMI shield and comprising a good conductor connected to the first EMI shield when hot docking; and an electrostatic discharge (ESD) contact portion comprising conductive rubber formed outside of the EMI connecting portion and co-axial with the EMI connecting portion, connected to the second EMI shield, higher in impedance than the EMI connecting portion, and coming in contact with the first EMI shield earlier than the EMI connecting portion at the time of hot docking and withdrawing to expose the EMI connecting portion in response to the ESD contact portion being pressed against the first EMI shield such that the EMI connecting portion comes in contact with the first EMI shield. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A function expansion device comprising:
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a second EMI shield; a second signal line enclosed by the second EMI shield; a second signal earth line enclosed by the second EMI shield; a second interface connector to which the second signal line and the second signal earth line are connected; an EMI connecting portion connected to the second EMI shield and comprising a good conductor connected to a first EMI shield when hot docked with a portable computer comprising the first EMI shield, a first signal line enclosed by the first EMI shield, a first signal earth line enclosed by the first EMI shield, and a first interface connector to which the first signal line and the first signal earth line are connected; and an ESD contact portion comprising conductive rubber formed outside of the second interface connector and co-axial with the second interface connector, connected to the second EMI shield, higher in impedance than the EMI connecting portion, and coming in contact with the first EMI shield earlier than the EMI connecting portion at the time of hot docking and withdrawing to expose the EMI connecting portion in response to the ESD contact portion being pressed against the first EMI shield such that the EMI connecting portion comes in contact with the first EMI shield.
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8. A method comprising:
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activating a portable computer; bringing the portable computer closer to a function expansion device with the portable computer active; performing ESD contact between an ESD contact portion connected to an EMI shield of the portable computer and an EMI shield of the function expansion device, the ESD contact portion comprising conductive rubber formed outside of an EMI connecting portion and co-axial with the EMI connecting portion; withdrawing the ESD contact portion to expose the EMI connecting portion in response to the ESD contact portion being pressed against the EMI shield of the function expansion device such that the EMI connecting portion comes in contact with the first EMI shield; performing EMI connection between the EMI connecting portion and the EMI shield of the function expansion device subsequent to withdrawing the ESD contact portion. - View Dependent Claims (9, 10)
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Specification