Method of fabricating interferometric devices using lift-off processing techniques
First Claim
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1. A method of making an interferometric modulator, comprising:
- forming a lift-off stencil over a substrate;
depositing a first material layer over the lift-off stencil and over the substrate, wherein the first material layer comprises indium tin oxide;
depositing a second material layer over the first material layer, wherein the second material layer comprises molybdenum; and
removing the lift-off stencil to thereby form a patterned region comprising the second material layer over the first material layer.
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Abstract
Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.
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Citations
18 Claims
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1. A method of making an interferometric modulator, comprising:
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forming a lift-off stencil over a substrate; depositing a first material layer over the lift-off stencil and over the substrate, wherein the first material layer comprises indium tin oxide; depositing a second material layer over the first material layer, wherein the second material layer comprises molybdenum; and removing the lift-off stencil to thereby form a patterned region comprising the second material layer over the first material layer. - View Dependent Claims (2, 4, 5, 6, 7)
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3. A method of making an interferometric modulator, comprising:
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forming a lift-off stencil over a substrate; depositing a first material layer over the lift-off stencil and over the substrate; depositing a second material layer over the first material layer; depositing a third material layer over the second material layer, wherein the third material layer comprises a dielectric material; depositing a fourth material layer over the third material layer, wherein the fourth material layer comprises molybdenum; and removing the lift-off stencil to thereby form a patterned region comprising the second material layer over the first material layer. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of making an interferometric modulator, comprising:
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forming a lift-off stencil over a substrate; depositing a first material layer over the lift-off stencil and over the substrate, wherein the first material layer comprises indium tin oxide; depositing a second material layer over the first material layer, wherein the second material layer comprises chromium; and removing the lift-off stencil to thereby form a patterned region comprising the second material layer over the first material layer. - View Dependent Claims (15, 16, 17, 18)
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Specification