Solid metal block semiconductor light emitting device mounting substrates

• US 7,906,793 B2
• Filed: 06/15/2009
• Issued: 03/15/2011
• Est. Priority Date: 10/25/2004
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H.
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US12/484,713
• Publication Number:
  US 20100133555A1
• Time in Patent Office: 638 Days
• Field of Search: 257/98, 257/99, 257/100, 257/676, 257/E33.072, 257/E33.073, 257/E33.075
• US Class Current: 257/98
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

the first metal face of the solid metal block including thereon a plurality of conductive traces that are arranged to electrically connect to at least one semiconductor light emitting device;

the second metal face of the solid metal block including therein a two-dimensional array of metal heat sink posts, the two-dimensional array extending in the second metal face of the solid metal block along two different directions;

wherein the first metal face also includes thereon a reflective layer; and

wherein the solid metal block includes first and second through holes that extend through the solid metal block from the first face to the second face and wherein the mounting substrate further comprises first and second conductive vias in the respective first and second through holes that are insulated from the solid metal block, a respective conductive via being electrically connected to a respective one of the plurality of conductive traces.

2. A mounting substrate according to claim 1 wherein the solid metal block includes an insulating layer thereon and wherein the plurality of conductive traces are on the insulating layer.

3. A mounting substrate according to claim 1 further comprising drive circuitry for at least one semiconductor light emitting device on the solid metal block.

4. A mounting substrate according to claim 1 wherein the metal heat sink posts are about 9 mm deep.

5. A mounting substrate according to claim 1 further comprising:

a semiconductor light emitting device on the solid metal block that is electrically connected to the plurality of traces; and

a light emitting device driver integrated circuit on the solid metal block that is also electrically connected to the plurality of conductive traces.

6. A mounting substrate according to claim 1 further comprising:

a semiconductor light emitting device on the solid metal block that is electrically connected to the plurality of traces; and

a phosphor layer on the solid metal block that is spaced apart from the semiconductor light emitting device and is arranged such that light that is emitted by the semiconductor light emitting device impinges on the phosphor layer.

7. A mounting substrate according to claim 6 further comprising a cover that overlies the first face and wherein the phosphor layer is in and/or on the cover.

8. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

the first metal face including thereon a plurality of conductive traces that are arranged to electrically connect to at least one semiconductor light emitting device;

the first metal face also including thereon a reflective layer that is separate from the plurality of conductive traces;

wherein the solid metal block includes first and second through holes that extend through the solid metal block from the first face to the second face and wherein the mounting substrate further comprises first and second conductive vias in the respective first and second through holes that are insulated from the solid metal block, a respective conductive via being electrically connected to a respective one of the plurality of conductive traces.

9. A mounting substrate according to claim 8 wherein the plurality of conductive traces comprise copper and wherein the reflective layer comprises silver.

10. A mounting substrate according to claim 8 wherein the solid metal block includes an insulating layer thereon and wherein the plurality of conductive traces are on the insulating layer.

11. A mounting substrate according to claim 8 further comprising drive circuitry for at least one semiconductor light emitting device on the solid metal block.

13. A mounting substrate according to claim 8 further comprising:

a semiconductor light emitting device on the solid metal block that is electrically connected to the plurality of traces; and

a phosphor layer on the solid metal block that is spaced apart from the semiconductor light emitting device and is arranged such that light that is emitted by the semiconductor light emitting device impinges on the phosphor layer.

14. A mounting substrate according to claim 13 further comprising a cover that overlies the first face and wherein the phosphor layer is in and/or on the cover.

12. A mounting substrate according to claim further comprising:

a semiconductor light emitting device on the solid metal block that is electrically connected to the plurality of conductive traces; and

a light emitting device driver integrated circuit on the solid metal block that is also electrically connected to the plurality of conductive traces.