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Stacked semiconductor package and method of making same

  • US 7,906,855 B1
  • Filed: 04/12/2010
  • Issued: 03/15/2011
  • Est. Priority Date: 01/21/2008
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a substrate;

    a first semiconductor die electrically connected to the substrate through the use of first conductive wires;

    a flow layer applied to a least a portion of the first semiconductor die;

    a second semiconductor die attached to the flow layer and electrically connected to the substrate; and

    a package body at least partially encapsulating the first semiconductor die, the second semiconductor die, the flow layer, the first conductive wires, and the substrate;

    the flow layer including at least first and second portions which are of differing viscosities, with the first conductive wires each further being partially encapsulated by at least one of the first and second portions of the flow layer.

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