Systems and methods for cooling a computing component in a computing rack

• US 7,907,409 B2
• Filed: 03/18/2009
• Issued: 03/15/2011
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Weber, Richard M., Wyatt, William G.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US12/406,645
• Publication Number:
  US 20090244830A1
• Time in Patent Office: 727 Days
• Field of Search: None
• US Class Current: 361/700
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.

Claims

1. A system for cooling computing components, comprising:

a computing rack housing a plurality of computing components of a computing system;

a heat absorbing plate disposed in and being removable from the computing rack, the heat absorbing plate being thermally coupled to an outer surface of a computing component of the plurality of computing components, the heat absorbing plate comprising;

a first portion thermally coupled to an outer surface of the computing component, and

a second portion being thermally coupled to a heat transfer mechanism, the first portion being generally perpendicular to the second portion, the first portion and the second portion defining a continuous cavity containing a two-phase coolant and allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to the heat transfer mechanism; and

a sidewall of the computing rack being thermally coupled to the second portion of the heat absorbing plate and comprising the heat transfer mechanism, the heat transfer mechanism being operable to receive the heat transferred from the heat absorbing plate.

2. The system of claim 1, further comprising a wicking material disposed in the cavity.

3. The system of claim 1, further comprising an interface material disposed between the outer surface of the computing component and the heat absorbing plate, the interface material reducing or removing air voids between the outer surface of the computing component and the heat absorbing plate.

4. A system for cooling computing components, comprising:

a computing rack housing a plurality of computing components of a computing system;

a heat absorbing plate disposed in the computing rack and being thermally coupled to an outer surface of a computing component of the plurality of computing components, the heat absorbing plate comprising;

a first portion thermally coupled to an outer surface of the computing component, and

a second portion being thermally coupled to a heat transfer mechanism, the first portion being generally perpendicular to the second portion, the first portion and the second portion defining a continuous cavity containing a two-phase coolant operable to remove heat from the computing component; and

a sidewall of the computing rack being thermally coupled to the second portion of the heat absorbing plate and comprising the heat transfer mechanism operable to remove heat from the heat absorbing plate.

5. The system of claim 4, wherein the heat transfer mechanism comprises a heat pipe.

6. The system of claim 4, wherein the heat transfer mechanism comprises a portion of a sub-ambient pressure cooling system.

7. The system of claim 6, wherein the portion of the sub-ambient pressure cooling system comprises:

a heat exchanger disposed in the sidewall, the heat exchanger being in thermal communication with the heat absorbing plate, the heat exchanger having an inlet and an outlet, the inlet operable to receive fluid coolant into the heat exchanger substantially in the form of a liquid, and the outlet operable to dispense fluid coolant out of the heat exchanger substantially in the form of a vapor, the fluid coolant in the heat exchanger being subjected to a sub-ambient pressure.

8. The system of claim 4, wherein a plurality of walls of the heat absorbing plate define a cavity that contains the two-phase coolant, the cavity being a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to the heat transfer mechanism.

9. The system of claim 8, further comprising a wicking material disposed in the cavity.

10. The system of claim 4, wherein the outer surface of the heat absorbing plate is an upper surface of the computing component.

11. The system of claim 4, wherein the computing rack comprises a support structure, and wherein the computing component and the support structure define a gap, the gap allowing removal of the computing component.

12. The system of claim 11, further comprising one or more biasing apparatuses coupled to the support structure, the biasing apparatuses creating the gap by biasing the computing component toward the heat absorbing plate.

13. The system of claim 4, wherein the heat absorbing plate is removable from the computing rack.

14. The system of claim 4, further comprising an interface material disposed between the outer surface of the computing component and the heat absorbing plate, the interface material reducing or removing air voids between the outer surface of the computing component and the heat absorbing plate.

15. The system of claim 4, wherein the heat absorbing plate is a heat pipe.

16. A method of cooling a computing component, comprising:

providing an electronic heat generating component within a computing component, the computing component being contained within a computing rack;

transferring heat generated by the electronic component to a base of the computing component;

transferring the heat from the base to a heat absorbing plate, the heat absorbing plate comprising;

a first portion thermally coupled to an outer surface of the computing component, and

a second portion being thermally coupled to a heat transfer mechanism, the first portion being generally perpendicular to the second portion, the first portion and the second portion defining a continuous cavity containing a two-phase coolant, the heat vaporizing the coolant;

transferring the heat from the second portion of the heat absorbing plate to the heat transfer mechanism within a sidewall of the computing rack; and

removing the heat from the computing rack by the heat transfer mechanism.

17. The method of claim 16, wherein the heat transfer mechanism comprises a heat pipe, and removing the heat from the computing rack comprises vaporizing a second two-phase coolant in the heat pipe.

18. The method of claim 16, wherein the heat transfer mechanism comprises a heat exchanger disposed in the sidewall of the computing rack and removing the heat from the computing rack comprises:

transferring the heat to the heat exchanger, the heat exchanger being in thermal communication with the heat absorbing plate, the heat exchanger having an inlet and an outlet, the inlet operable to receive fluid coolant into the heat exchanger substantially in the form of a liquid, and the outlet operable to dispense fluid coolant out of the heat exchanger substantially in the form of a vapor, the fluid coolant in the heat exchanger being subjected to a sub-ambient pressure.

19. The method of claim 16, further comprising communicating the two-phase coolant in a liquid phase within the heat absorbing plate using a wicking material, the wicking material using capillary action to communicate the liquid phase coolant.

20. The method of claim 16, further comprising creating a gap between the computing component and a support structure by biasing the computing component toward the heat absorbing plate using at least one biasing apparatus.

21. The method of claim 20, further comprising biasing the computing component away from the heat absorbing plate using the at least one biasing apparatus to allow the computing component to be removed from the computing rack.

22. The method of claim 16, further comprising:

transferring the heat from the computing component to the heat absorbing plate through an interface material; and

transferring the heat from the heat absorbing plate to the heat transfer mechanism through the interface material, the interface material reducing or removing air voids between the heat absorbing plate and the computing component and reducing or removing air voids between the heat absorbing plate and the sidewall.