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Planarization films for advanced microelectronic applications and devices and methods of production thereof

  • US 7,910,223 B2
  • Filed: 10/27/2003
  • Issued: 03/22/2011
  • Est. Priority Date: 07/17/2003
  • Status: Active Grant
First Claim
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1. A film comprising a planarization composition wherein the planarization composition consists of:

  • an o-cresol-based polymer compound and a resol phenolic resin;

    at least one surfactant; and

    a solvent system consisting of at least one solvent, wherein at least some of the solvent system is removed.

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