Planarization films for advanced microelectronic applications and devices and methods of production thereof

• US 7,910,223 B2
• Filed: 10/27/2003
• Issued: 03/22/2011
• Est. Priority Date: 07/17/2003
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Huang, Wei, Katsanes, Ronald, Kennedy, Joseph
• Primary Examiner(s): Yoon; Tae H
• Application Number:
  US10/518,201
• Publication Number:
  US 20060106160A1
• Time in Patent Office: 2,703 Days
• Field of Search: 524/509, 528/154, 528/501, 427/96, 428/524, 430/270.1
• US Class Current: 428/524
• CPC Class Codes: C04B 2103/0093 Organic cosolvents
• CPC Class Codes: C04B 2103/40 Surface-active agents, dispersants
• CPC Class Codes: C04B 2111/00482 Coating or impregnation materials
• CPC Class Codes: C04B 26/12 Condensation polymers of aldehydes or ketones
• CPC Class Codes: C08J 2361/00 Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
• CPC Class Codes: C08J 7/02 with solvents, e.g. swelling agents
• CPC Class Codes: C23F 1/10 Etching compositions C23F1/44 takes precedence
• CPC Class Codes: C23F 1/44 Compositions for etching metallic material from a metallic material substrate of different composition
• CPC Class Codes: C23F 3/00 Brightening metals by chemical means
• CPC Class Codes: C23F 3/04 Heavy metals
• CPC Class Codes: H01L 21/02118 carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC polymers per se C08G, photoresist per se G03F
• CPC Class Codes: H01L 21/02282 liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• CPC Class Codes: H01L 21/31051 Planarisation of the insulating layers H01L21/31058 takes precedence
• CPC Class Codes: H01L 21/312 Organic layers, e.g. photoresist H01L21/3105, H01L21/32 take precedence; photoresists per se G03C
• CPC Class Codes: Y10T 428/31942 Of aldehyde or ketone condensation product

Abstract

A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.

Claims

1. A film comprising a planarization composition wherein the planarization composition consists of:

an o-cresol-based polymer compound and a resol phenolic resin;

at least one surfactant; and

a solvent system consisting of at least one solvent, wherein at least some of the solvent system is removed.

4. A layered component, comprising:

a substrate having a surface topography; and

a layer comprising the film of claim 1, wherein the layer is coupled to the substrate.

5. The layered component of claim 4, further comprising at least one additional layer of material or film.

2. A layered component, comprising:

a substrate having a surface topography; and

a planarization composition consisting of;

an o-cresol-based polymer compound and a resol phenolic resin;

at least one surfactant; and

a solvent system consisting of at least one solvent, and wherein the composition is coupled to the substrate.

3. The layered component of claim 2, further comprising at least one additional layer of material or film.

6. A method of forming a film, comprising:

providing a planarization composition consisting of;

an o-cresol-based polymer compound and a resol phenolic resin;

at least one surfactant; and

a solvent system consisting of at least one solvent, and evaporating at least part of the solvent system to form a film.

7. The method of claim 6, wherein evaporating at least part of the solvent system comprises applying a continuous source to the planarization composition.

8. The method of claim 7, wherein the continuous source comprises a heat source.

9. The method of claim 8, wherein the continuous source comprises an infrared source, an ultraviolet source, an electron-beam source and combinations thereof.