Photomask with detector for optimizing an integrated circuit production process and method of manufacturing an integrated circuit using the same

• US 7,910,269 B2
• Filed: 03/19/2010
• Issued: 03/22/2011
• Est. Priority Date: 04/20/2007
• Status: Active Grant

• Current Assignee: Phototronics Incorporated
• Original Assignee: Phototronics Incorporated
• Inventors: Progler, Christopher
• Primary Examiner(s): Rosasco; Stephen
• Assistant Examiner(s): Fraser; Stewart A
• Application Number:
  US12/727,342
• Publication Number:
  US 20100174393A1
• Time in Patent Office: 368 Days
• Field of Search: 430/5, 430/22, 430/30, 430311-313, 700/121, 324/457, 438/14, 438/585, 382/100
• US Class Current: 430/5
• CPC Class Codes: G03F 1/44 Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales

Abstract

A photomask for integrated circuit production comprising a substrate, one or more layers and a detector for monitoring a process parameter of the integrated circuit production in combination with one or more of the following: communication circuitry for communicating with external equipment for the integrated circuit production, a computational processor for analyzing the monitored process parameter, and a data storage component. In addition, a method of integrated circuit production comprising the steps of providing a photomask in the integrated circuit production process and monitoring a process parameter of the integrated circuit production using the photomask, in combination with one or more following steps: analyzing the monitored process parameter using the photomask; communicating the monitored process parameter from the photomask to external equipment involved in the integrated circuit production; and storing the monitored process parameter in the photomask. For example, the photomask embodying aspects of the present invention may monitor and track the process parameter of a stepper during the integrated circuit production. The monitored data may be analyzed against the production information to determine possible adjustment or alteration to the integrated circuit production steps.

Claims

1. A method of integrated circuit production comprising the steps of:

providing a photomask with circuitry in the integrated circuit production process;

monitoring a process parameter of the integrated circuit production using the circuitry;

analyzing the monitored process parameter using the photomask; and

adjusting the integrated circuit production process based on the result of the analyzing step.

2. The method of claim 1, wherein the process parameter comprises at least one process parameter selected from the group consisting of:

optical radiation, exposure level, vibration, position, illumination characteristics, scattered light, diffracted light, image characteristics in a reflected light mode, and physical location of the photomask.

3. The method of claim 1, wherein the analyzing step comprises the step of comparing the results of the monitoring step with expected results stored in a memory device associated with the photomask.

4. The method of claim 3, wherein photomask comprises the memory device.

5. The method of claim 1, wherein the analyzing step comprises the step of processing the monitored process parameter using computational logic.

6. The method of claim 1, further, comprising the step of communicating the result of the analyzing step from the photomask to external equipment involved in the integrated circuit production.

7. The method of claim 6, wherein the external equipment comprises at least one type of equipment selected from the group consisting of:

photomask manufacturing equipment, wafer exposure equipment, a design automation tool, a simulation tool, a process control system, a central database, a computer workstation, and a sensing station.

8. The method of claim 1, further comprising the step of storing the monitored process parameter in the photomask.

9. The method of claim 1, further comprising the step of storing the result of the analyzing step in the photomask.

10. The method of claim 1, further comprising, prior to the monitoring step, the step of conditioning the process parameter to be monitored using the photomask.

11. The method of claim 10, wherein the conditioning step comprises the step of diffracting optical radiation using the photomask.

12. The method of claim 10, wherein the conditioning step comprises the step of reflecting optical radiation using the photomask.

13. The method of claim 10, wherein the conditioning step comprises the step of scattering optical radiation using the photomask.

14. The method of claim 10, wherein the conditioning step comprises the step of directing optical radiation toward a detection plane using the photomask.

15. A method of integrated circuit production comprising the steps of:

providing a photomask with circuitry in the integrated circuit production process;

monitoring a process parameter of the integrated circuit production using the circuitry;

analyzing the monitored process parameter using the photomask;

adjusting the integrated circuit production process based on the result of the analyzing step; and

securing the photomask against at least one of unauthorized use and copying.

16. The method of claim 15, wherein the step of securing comprises transmitting signals to one or more of the external equipment to validate connection of the photomask with the one or more external equipment.

17. The method of claim 16, further comprising a step of encrypting the signals.

18. The method of claim 15, wherein the step of securing comprises detecting one or more characteristics of the photomask to ensure that the photomask was not subjected to at least one of manipulation and replacement.

19. The method of claim 18, wherein the one or more characteristics comprises a scattered light thumbprint of the photomask.

20. The method of claim 15, wherein the step of securing comprises selectively blocking the photomask with a blocking aperture.