Semiconductor light-emitting device and light-emitting display therewith

• US 7,910,939 B2
• Filed: 08/24/2007
• Issued: 03/22/2011
• Est. Priority Date: 09/21/2000
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Takase, Wataru, Kanesaka, Kaori, Suzuki, Kiyoshi, Hanamoto, Tetsuya, Sagara, Tomokazu
• Primary Examiner(s): Jackson, Jr.; Jerome
• Application Number:
  US11/844,622
• Publication Number:
  US 20080042156A1
• Time in Patent Office: 1,306 Days
• Field of Search: 257/98
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01063 : Europium [Eu]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/00 : Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof H10K50/00 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components having potential barriers, specially adapted for light emission H01L27/15; semiconductor lasers H01S5/00
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A semiconductor light-emitting device has a semiconductor light-emitting element for emitting light with emission wavelengths of 390 to 420 nm, wherein the wavelengths of light from the semiconductor light-emitting element are converted by a fluorescent substance having a monochromatic emission peak. The emission wavelengths of 390 to 420 nm, which have almost no adverse effect on human bodies and components of the semiconductor light-emitting device, are in a low human visibility range. Since light whose wavelengths are converted by the fluorescent substance are hardly affected by direct light from the semiconductor light-emitting element, light from the fluorescent substance has a favorable color tone. Also, the semiconductor light-emitting device allows desired luminous colors to be obtained only by changing fluorescent substance materials without changing the structure of the semiconductor light-emitting device or the semiconductor light-emitting element.

Claims

1. A light-emitting display device comprising:

a light source comprising a semiconductor light-emitting device constituted by mounting a semiconductor light-emitting element on a base substance and sealing the semiconductor light-emitting element and fluorescent substances by a sealing resin;

a light guiding plate for guiding light from the light source; and

red, green and blue color filters for transmitting light from the light guiding plate and dividing the light;

the light-emitting display device, wherein

the semiconductor light-emitting element emits light having an emission wavelength only in a range of 390 to 420 nm, the light having visibility lower than light in a visible range more than 420 nm;

only a first fluorescent substance, a second fluorescent substance and a third fluorescent substance are included in the fluorescent substances;

the first fluorescent substance has red outgoing light having emission wavelengths with its main emission peak in a wavelength range of 600 to 670 nm;

the second fluorescent substance has green outgoing light having emission wavelengths with its main emission peak in a wavelength range of 500 to 540 nm;

the third fluorescent substance has blue outgoing light having emission wavelengths with its main emission peak in a wavelength range of 410 to 480 nm;

the sum of colors of light emitted from the first, second and third fluorescent substances is a white color;

outgoing light from the semiconductor light-emitting device has a wavelength distribution that matches spectral characteristics of the color filters;

the following is adjusted so that the wavelength distribution of the outgoing light from the semiconductor light-emitting device matches spectral characteristics of the color filters;

the emission wavelength of the semiconductor light-emitting element;

the emission wavelength of the first fluorescent substance;

the emission wavelength of the second fluorescent substance;

the emission wavelength of the third fluorescent substance;

the mixture proportions of the first, second and third fluorescent substances; and

the proportion of the total weight of the first, second and third fluorescent substances to the weight of the sealing resin.