Semiconductor apparatus including a double-sided electrode element and method for manufacturing the same
First Claim
1. A semiconductor apparatus comprising:
- a semiconductor substrate that has a first surface and a second surface opposite to each other, and that has a plurality of element forming regions;
an insulation trench that surrounds each of the plurality of element forming regions, and that insulates and separates the plurality of element forming regions from each other; and
a plurality of elements that is respectively located in the plurality of element forming regions, wherein the plurality of elements includes at least two double-sided electrode elements, wherein each double-sided electrode element includes;
a first electrode that is located on one of the first surface and the second surface of the semiconductor substrate;
a second electrode that is located on the other of the first surface and the second surface of the semiconductor substrate, wherein the double-sided electrode element is configured so that a current flows between the first electrode and the second electrode;
a PN column region that is located in the semiconductor substrate, and that includes a plurality of P conductivity type semiconductor parts and a plurality of N conductivity type semiconductor parts, wherein the plurality of P conductivity type semiconductor parts and the plurality of N conductivity type semiconductor parts are alternately and adjacently arranged in series with each other without an insulating film therebetween in a direction perpendicular to a thickness direction of the semiconductor substrate; and
a drift region that is provided by one of;
the plurality of P conductivity type semiconductor parts; and
the plurality of N conductivity type semiconductor parts of the PN column region wherein the at least two double-sided electrode elements include at least one P channel type double-sided electrode element and at least one N channel type double-sided electrode element;
the at least one P channel type double-sided electrode element utilizes the plurality of P conductivity type semiconductor parts as the drift region; and
the at least one N channel type double-sided electrode element utilizes the plurality of N conductivity type semiconductor parts as the drift region.
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Abstract
A semiconductor apparatus is disclosed. The semiconductor apparatus includes a semiconductor substrate that has a first surface and a second surface opposite to each other. The semiconductor apparatus further includes multiple double-sided electrode elements each having a pair of electrodes located respectively on the first and second surfaces of the semiconductor substrate. A current flows between the first and second electrode. Each double-sided electrode element has a PN column region located in the semiconductor substrate. The semiconductor apparatus further includes an insulation trench that surrounds each of multiple double-sided electrode elements, and that insulates and separates the multiple double-sided electrode elements from each other.
17 Citations
19 Claims
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1. A semiconductor apparatus comprising:
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a semiconductor substrate that has a first surface and a second surface opposite to each other, and that has a plurality of element forming regions; an insulation trench that surrounds each of the plurality of element forming regions, and that insulates and separates the plurality of element forming regions from each other; and a plurality of elements that is respectively located in the plurality of element forming regions, wherein the plurality of elements includes at least two double-sided electrode elements, wherein each double-sided electrode element includes; a first electrode that is located on one of the first surface and the second surface of the semiconductor substrate; a second electrode that is located on the other of the first surface and the second surface of the semiconductor substrate, wherein the double-sided electrode element is configured so that a current flows between the first electrode and the second electrode; a PN column region that is located in the semiconductor substrate, and that includes a plurality of P conductivity type semiconductor parts and a plurality of N conductivity type semiconductor parts, wherein the plurality of P conductivity type semiconductor parts and the plurality of N conductivity type semiconductor parts are alternately and adjacently arranged in series with each other without an insulating film therebetween in a direction perpendicular to a thickness direction of the semiconductor substrate; and a drift region that is provided by one of;
the plurality of P conductivity type semiconductor parts; and
the plurality of N conductivity type semiconductor parts of the PN column region wherein the at least two double-sided electrode elements include at least one P channel type double-sided electrode element and at least one N channel type double-sided electrode element;
the at least one P channel type double-sided electrode element utilizes the plurality of P conductivity type semiconductor parts as the drift region; and
the at least one N channel type double-sided electrode element utilizes the plurality of N conductivity type semiconductor parts as the drift region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification