Mounted body and method for manufacturing the same

• US 7,911,064 B2
• Filed: 02/28/2006
• Issued: 03/22/2011
• Est. Priority Date: 03/07/2005
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Komatsu, Shingo, Nakatani, Seiichi, Kitae, Takashi, Yamashita, Yoshihisa, Kojima, Toshiyuki, Karashima, Seiji
• Primary Examiner(s): Smith; Zandra
• Assistant Examiner(s): Joy; Jeremy J
• Application Number:
  US11/908,087
• Publication Number:
  US 20090230546A1
• Time in Patent Office: 1,848 Days
• Field of Search: 257/737, 257/777, 257/778, 257/E21.508, 257/E23.021, 257/E25.013, 438/108, 438615-616
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83886 Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/30105 : Capacitance

Abstract

A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.

Claims

1. A method for manufacturing a mounted body, the method comprising the steps of:

providing a solder resin paste between a multilayer semiconductor chip comprising a plurality of semiconductor chips that are stacked and a mounting board on which the multilayer semiconductor chip is mounted including areas where a solder bump is not to be formed, the solder resin paste containing a resin, a solder powder, and a convection additive that boils when heated; and

heating the solder resin paste so that motion of the boiling convection additive in the resin gives kinetic energy to solder particles dispersed in the resin to promote a movement of the solder particles, thus causing the solder powder to assemble to form the solder bump, whereby an element electrode of each semiconductor chip of the multilayer semiconductor chip and an electrode terminal formed on the mounting board so as to correspond to the element electrode are connected electrically to each other collectively.

2. The method according to claim 1, wherein, in the multilayer semiconductor chip, at least the semiconductor chip adjacent to the mounting board is a thin semiconductor chip having a thickness of 100 μ

m or less.

3. The method according to claim 1, wherein the solder powder has a melting point in a range from 10°

C. to 330°

C.

7. The method according to claim 1, wherein the convection additive generates heat when the resin is heated.

8. The method according to claim 1, wherein the convection additive is a compound containing crystal water, a compound decomposed by being heated, or a foaming agent.

11. The method according to claim 1, wherein only the solder resin paste is used to join the semiconductor chip to the mounting board.

12. The method according to claim 1, wherein the resin in the solder resin paste forms into an underfill between the semiconductor chip and the mounting board.

4. A method for manufacturing a mounted body, the method comprising the steps of:

providing a solder resin paste between a first semiconductor chip and a mounting board on which the first semiconductor chip is mounted including areas where a first solder bump is not to be formed, the solder resin paste containing a resin, a solder powder, and a convection additive that boils when heated;

heating the solder resin paste so that motion of the boiling convection additive in the resin gives kinetic energy to solder particles dispersed in the resin to promote a movement of the solder particles, thus causing the solder powder to assemble to form the first solder bump, whereby an element electrode of the first semiconductor chip and an electrode terminal formed on the mounting board so as to correspond to the element electrode are connected electrically to each other collectively;

joining a second semiconductor chip having a principal surface to be joined to a rear surface of the first semiconductor chip and a second element electrode formed on the principal surface to the rear surface of the first semiconductor chip, and providing the solder resin paste between the mounting board and the second semiconductor chip including areas where a second solder bump is not to be formed; and

heating the solder resin paste so that motion of the boiling convection additive in the resin gives kinetic energy to solder particles dispersed in the resin to promote a movement of the solder particles, thus causing the solder powder to assemble to form the second solder bump, whereby the element electrode of the second semiconductor chip and an electrode terminal formed on the mounting board so as to correspond to the element electrode are connected electrically to each other collectively.

5. The method according to claim 4, wherein, in the multilayer semiconductor chip, at least the semiconductor chip adjacent to the mounting board is a thin semiconductor chip having a thickness of 100 μ

m or less.

6. The method according to claim 4, wherein the solder powder has a melting point in a range from 10°

C. to 330°

C.

9. The method according to claim 4, wherein the convection additive generates heat when the resin is heated.

10. The method according to claim 4, wherein the convection additive is a compound containing crystal water, a compound decomposed by being heated, or a foaming agent.

13. A method for manufacturing a mounted body, the method comprising the steps of:

providing a solder resin paste that simultaneously provides a resin for joining a semiconductor chip to a mounting board, and a solder powder for forming an electrical connection between the semiconductor chip and the mounting board between the multilayer semiconductor chip comprising a plurality of semiconductor chips that are stacked and a mounting board on which the multilayer semiconductor chip is mounted, the solder resin paste containing the resin, the solder powder, and a convection additive that boils when heated; and

heating the solder resin paste so that motion of the boiling convection additive in the resin gives kinetic energy to solder particles dispersed in the resin to promote a movement of the solder particles, thus causing the solder powder to assemble to form a solder bump, whereby an element electrode of each semiconductor chip of the multilayer semiconductor chip and an electrode terminal formed on the mounting board so as to correspond to the element electrode are connected electrically to each other collectively.