Avionics chassis

• US 7,911,796 B2
• Filed: 06/19/2009
• Issued: 03/22/2011
• Est. Priority Date: 06/19/2009
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Coxon, Danny Weldon, Vander Ploeg, Benjamin Jon, Steenwyk, Meredith Marie, Streyle, John Jay
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US12/487,850
• Publication Number:
  US 20100321892A1
• Time in Patent Office: 641 Days
• Field of Search: None
• US Class Current: 361/707
• CPC Class Codes: H05K 7/1412 hold down mechanisms, e.g. avionic racks
• CPC Class Codes: H05K 7/20545 Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
• CPC Class Codes: H05K 9/0062 Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications

Abstract

An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

Claims

1. An avionics chassis assembly comprising:

a housing having an interior and exterior, comprising;

a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix;

at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix;

a plurality of spaced, thermally-conductive, card rails provided on the at least two walls;

wherein the at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

2. The avionics chassis assembly of claim 1, further comprising at least one printed circuit board located within the slot.

3. The avionics chassis assembly of claim 2, wherein the card rails comprise grooves forming part of the slot and the printed circuit board comprises wedge locks that are received within the grooves to selectively lock the printed circuit board to the card rails and form part of the thermally conductive path.

4. The avionics chassis assembly of claim 3, wherein the wedge locks are metal and the walls are metal plated to seal the carbon fibers against galvanic corrosion with the wedge locks.

5. The avionics chassis assembly of claim 4, further comprising heat-dissipating fins composed of carbon fiber and projecting from the at least one thermally conductive wall to the exterior of the housing to form part of the thermally conductive path.

6. The avionics chassis assembly of claim 5, wherein the heat-dissipating fins are co-cured to the housing.

7. The avionics chassis assembly of claim 5, wherein the heat-dissipating fins are formed by machining.

8. The avionics chassis assembly of claim 6, wherein the heat-dissipating fins are aligned with the rails.

9. The avionics chassis assembly of claim 8, wherein the heat-dissipating fins are coextensive with the rails.

10. The avionics chassis assembly of claim 1, wherein the walls are mounted to the frame with at least one mechanical fastener.

11. The avionics chassis assembly of claim 1, wherein the walls are mounted to the frame with at least one adhesive.

12. The avionics chassis assembly of claim 11, wherein the at least one adhesive is thermally conductive.

13. The avionics chassis assembly of claim 11, wherein the at least one adhesive is a structural adhesive.

14. The avionics chassis assembly of claim 1, wherein the carbon fibers in the at least one thermally conductive wall are laid up such that the wall is thermally conductive in a two-dimensional plane.

15. The avionics chassis assembly of claim 1, wherein the walls are metal plated.

16. The avionics chassis assembly of claim 1, wherein the housing further comprises at least one thermally non-conductive wall.