Method of manufacturing a flexible circuit electrode array
First Claim
1. A method for manufacturing a flexible circuit electrode array, comprising the steps of:
- depositing a metal trace layer on an insulator polymer base layer having a surface;
applying a photoresist layer on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer;
activating said insulator polymer base layer and depositing a top insulator polymer layer and forming an insulating polymer layer with said insulator polymer base layer;
heating said insulator polymer base layer at between 80-150°
C. and then between 230-350°
C.;
whereinactivating said insulator polymer base layer by etching said surface of said insulator polymer base layer by reactive ion etching and deimidizing said surface of said insulator polymer base layer.
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Accused Products
Abstract
Polymer materials form electrode array bodies for neural stimulation, especially for retinal stimulation to create vision. The method lays down a polymer layer. Apply a metal layer to the polymer and pattern to create electrodes and leads. Apply a second polymer layer over the metal layer and pattern to leave openings for electrodes. The array and its supply cable are a single body. A method for manufacturing a flexible circuit electrode array, is: deposit a metal trace layer on an insulator polymer base layer; apply a layer of photoresist on the metal trace layer and pattern the metal trace layer and form metal traces on the insulator polymer base layer; activate the insulator polymer base layer and deposit a top insulator polymer layer and form a single insulating polymer layer with the base insulator polymer layer; wherein the insulator polymer layers are heated at 80-150° C. and then at 230-350° C.
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Citations
2 Claims
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1. A method for manufacturing a flexible circuit electrode array, comprising the steps of:
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depositing a metal trace layer on an insulator polymer base layer having a surface; applying a photoresist layer on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; activating said insulator polymer base layer and depositing a top insulator polymer layer and forming an insulating polymer layer with said insulator polymer base layer;
heating said insulator polymer base layer at between 80-150°
C. and then between 230-350°
C.;
whereinactivating said insulator polymer base layer by etching said surface of said insulator polymer base layer by reactive ion etching and deimidizing said surface of said insulator polymer base layer.
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2. A method for manufacturing a flexible circuit electrode array, comprising the steps of:
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depositing a metal trace layer on an insulator polymer base layer having a surface; applying a photoresist layer on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; activating said insulator polymer base layer and depositing a top insulator polymer layer and forming an insulating polymer layer with said insulator polymer base layer;
heating said insulator polymer layer at between 80-150°
C. and then between 230-350°
C.;
whereindeimidizing said surface of said insulator polymer base layer by sequential treatments with KOH and HCl.
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Specification