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Method of manufacturing a flexible circuit electrode array

  • US 7,914,842 B1
  • Filed: 02/06/2007
  • Issued: 03/29/2011
  • Est. Priority Date: 02/10/2006
  • Status: Active Grant
First Claim
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1. A method for manufacturing a flexible circuit electrode array, comprising the steps of:

  • depositing a metal trace layer on an insulator polymer base layer having a surface;

    applying a photoresist layer on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer;

    activating said insulator polymer base layer and depositing a top insulator polymer layer and forming an insulating polymer layer with said insulator polymer base layer;

    heating said insulator polymer base layer at between 80-150°

    C. and then between 230-350°

    C.;

    whereinactivating said insulator polymer base layer by etching said surface of said insulator polymer base layer by reactive ion etching and deimidizing said surface of said insulator polymer base layer.

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