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Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same

  • US 7,915,058 B2
  • Filed: 01/19/2006
  • Issued: 03/29/2011
  • Est. Priority Date: 01/28/2005
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a substrate having a film pattern comprising:

  • forming a film on a substrate in which silicon combines with oxygen and an inactive group;

    printing a composition on the film by screen printing method through mesh; and

    baking the composition to form a film pattern with a thickness of 5 to 40 μ

    m, wherein the thickness is obtained after a single printing and baking.

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