Environmentally robust lighting devices and methods of manufacturing same

• US 7,915,061 B2
• Filed: 05/30/2008
• Issued: 03/29/2011
• Est. Priority Date: 05/31/2007
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: Aanegola, Srinath K., Nall, Jeffrey Marc, Carpenter, Kevin, Saha, Koushik, Wang, Xin
• Primary Examiner(s): Richards; N Drew
• Assistant Examiner(s): Withers; Grant S
• Application Number:
  US12/129,925
• Publication Number:
  US 20080296607A1
• Time in Patent Office: 1,033 Days
• Field of Search: 438/26, 438/27
• US Class Current: 438/26
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

Claims

1. A method of fabricating a lighting device, the method comprising:

mounting a light emitting chip to a supporting surface of a substrate, the light emitting chip being a surface mount light emitting chip with or without an intervening submount, the substrate being configured to convey electrical power to the light emitting chip;

overmolding at least a portion of the supporting surface of the substrate, the overmolding not covering or contacting the light emitting chip, such that a gap is created between the overmolding and the light emitting chip;

encapsulating the light emitting chip with a silicone encapsulant; and

sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer.

2. The method as set forth in claim 1, wherein the sealing comprises:

adhering the light transmissive vinyl or acrylic layer as a unit to at least the silicone encapsulant using an intervening adhesive.

3. The method as set forth in claim 1, wherein the sealing comprises:

disposing the light transmissive vinyl or acrylic layer as a unit over at least the silicone encapsulant.

4. The method as set forth in claim 3, wherein the encapsulant includes a top surface and two side surfaces, the sealing further comprises:

substantially conforming the disposed unitary light transmissive vinyl or acrylic layer only to the top surface and side surfaces of the silicone encapsulant.

5. The method as set forth in claim 1, wherein

the sealing is performed subsequent to the overmolding and comprises disposing the light transmissive vinyl or acrylic layer as a unit over at least the silicone encapsulant.

15. The method as set forth in claim 1, wherein said overmolding is substantially opaque.

6. A method of fabricating a lighting device, the method comprising:

mounting a light emitting chip to a supporting surface of a substrate, the light emitting chip being a surface mount light emitting chip with or without an intervening submount, the substrate being configured to convey electrical power to the light emitting chip;

overmolding at least a portion of the supporting surface of the substrate, the overmolding not covering or contacting the light emitting chip, such that a gap is created between the overmolding and the light emitting chip;

encapsulating the light emitting chip with an encapsulant; and

sealing an assembly including at least the encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

7. The method as set forth in claim 6, wherein the encapsulating comprises:

encapsulating the light emitting chip with a silicone encapsulant.

8. The method as set forth in claim 6, wherein the sealing comprises:

adhering the light transmissive plastic layer as a unit to at least the encapsulant using an intervening adhesive.

9. The method as set forth in claim 6,

wherein the sealing is performed subsequent to the overmolding and comprises disposing the light transmissive plastic layer as a unit over at least the encapsulant.

10. The method as set forth in claim 6, wherein the sealing comprises:

sealing the assembly by disposing a light transmissive vinyl or acrylic layer as a unit over the assembly.

11. The method as set forth in claim 6, wherein the sealing comprises:

sealing the assembly by disposing a light transmissive plastic layer as a unit over the assembly, the light transmissive plastic layer being selected from a group consisting of vinyl, acrylic, polycarbonate, and polyethylene.

12. The method as set forth in claim 6, wherein the sealing comprises:

sealing the assembly by disposing an environmentally resistant light transmissive plastic layer as a unit over the assembly.

13. The method as set forth in claim 6, wherein the sealing comprises adhering a rigid plastic cap over at least the top surface and each side surface of the silicone encapsulant using an intervening adhesive.

14. The method as set forth in claim 13, wherein the sealing occurs prior to overmolding, such that the overmolding is disposed over a periphery of said plastic cap.