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Environmentally robust lighting devices and methods of manufacturing same

  • US 7,915,061 B2
  • Filed: 05/30/2008
  • Issued: 03/29/2011
  • Est. Priority Date: 05/31/2007
  • Status: Active Grant
First Claim
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1. A method of fabricating a lighting device, the method comprising:

  • mounting a light emitting chip to a supporting surface of a substrate, the light emitting chip being a surface mount light emitting chip with or without an intervening submount, the substrate being configured to convey electrical power to the light emitting chip;

    overmolding at least a portion of the supporting surface of the substrate, the overmolding not covering or contacting the light emitting chip, such that a gap is created between the overmolding and the light emitting chip;

    encapsulating the light emitting chip with a silicone encapsulant; and

    sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer.

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