Methods of making electromechanical three-trace junction devices
First Claim
Patent Images
1. A method of producing a circuit element, the method comprising:
- providing a first structure having first support structures and a first electrically conductive element;
providing a layer of nanoscopic conductive elements on a surface of the first structure so as to contact the first support structures;
patterning the layer;
removing some of the nanoscopic elements in accordance with a defined pattern; and
providing a second structure having second support structures and a second electrically conductive element, wherein the second support structures contact the nanoscopic conductive elements and pin the nanoscopic conductive elements to the first support structure;
wherein the defined pattern defines an orientation of the nanoscopic elements;
wherein the first conductive element has a defined orientation that is substantially perpendicular to the orientation of the nanoscopic elements.
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Abstract
Methods of producing an electromechanical circuit element are described. A lower structure having lower support structures and a lower electrically conductive element is provided. A nanotube ribbon (or other electromechanically responsive element) is formed on an upper surface of the lower structure so as to contact the lower support structures. An upper structure is provided over the nanotube ribbon. The upper structure includes upper support structures and an upper electrically conductive element. In some arrangements, the upper and lower electrically conductive elements are in vertical alignment, but in some arrangements they are not.
281 Citations
19 Claims
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1. A method of producing a circuit element, the method comprising:
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providing a first structure having first support structures and a first electrically conductive element; providing a layer of nanoscopic conductive elements on a surface of the first structure so as to contact the first support structures; patterning the layer; removing some of the nanoscopic elements in accordance with a defined pattern; and providing a second structure having second support structures and a second electrically conductive element, wherein the second support structures contact the nanoscopic conductive elements and pin the nanoscopic conductive elements to the first support structure; wherein the defined pattern defines an orientation of the nanoscopic elements; wherein the first conductive element has a defined orientation that is substantially perpendicular to the orientation of the nanoscopic elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of producing a circuit element, the method comprising:
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providing a first structure; providing a layer of nanoscopic conductive elements on a surface of the first structure so as to contact the first support structures; patterning the layer; removing some of the nanoscopic elements in accordance with a defined pattern; and providing a second structure in contact with the nanoscopic conductive elements, wherein the second structure pins the nanoscopic conductive elements to the first structure; wherein at least one of the first and second structures includes a region having sacrificial material in contact with the nanoscopic conductive elements, and wherein the method includes the removal of the material. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification