Crosstalk suppression in wireless testing of semiconductor devices

• US 7,915,908 B2
• Filed: 02/26/2008
• Issued: 03/29/2011
• Est. Priority Date: 02/28/2007
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SA (STMicroelectronics NV), STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Pagani, Alberto
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Velez; Roberto
• Application Number:
  US12/037,319
• Publication Number:
  US 20080204055A1
• Time in Patent Office: 1,127 Days
• Field of Search: None
• US Class Current: 324/762.01
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

Claims

1. A semiconductor material wafer comprising at least one first semiconductor material die and at least one second semiconductor material die, the first die having a first integrated circuit integrated thereon and the second die having a second integrated circuit integrated thereon, the semiconductor material wafer comprising:

first means for setting at least a first selected radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the first integrated circuit for a wireless test of the first integrated circuit, and

second means for setting at least a second selected radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the second integrated circuit for a wireless test of the second integrated circuit, wherein the second selected radio communication frequency is different from the first selected radio communication frequency.

2. The semiconductor material wafer according to claim 1, wherein the at least one first semiconductor material die and the at least one second semiconductor material die are adjacent.

3. The semiconductor material wafer according to claim 1, wherein the first means for setting and the second means for setting are adapted to allow independently setting the first selected radio communication frequency and the second selected radio communication frequency.

4. A method for wirelessly testing a first integrated circuit integrated on a first semiconductor material die and a second integrated circuit integrated on a second semiconductor material die, comprising:

configuring, in response to receiving a signal indicating a first radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the first integrated circuit to be used for testing the first integrated circuit, a first communication circuit coupled to the first integrated circuit to define a frequency of operation of the first communication circuit to match the first radio communication frequency; and

configuring, in response to receiving a signal indicating a second radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the second integrated circuit for testing the second integrated circuit, a second communication circuit coupled to the second integrated circuit to define a frequency of operation of the second communication circuit to match the second radio communication frequency,

wherein the first radio communication frequency is distinct from the second radio communication frequency.

5. A test system for testing at least one first integrated circuit and at least one second integrated circuit, the first integrated circuit and the second integrated circuit being respectively integrated on a first semiconductor material die and on a second semiconductor material die of a semiconductor material wafer, the test system including:

a wireless probe card adapted to act as a wireless communication interface between a tester and the dies of the semiconductor material wafer,

first means for setting at least a first selected radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the first integrated circuit for a wireless test of the first integrated circuit, the first means being integrated on the first semiconductor material die, and

second means for setting at least a second selected radio communication frequency to be used for wirelessly communicating a radio signal having a test signal modulated thereon to the second integrated circuit for a wireless test of the second integrated circuit, the second means being integrated on the second semiconductor material die, the first selected radio communication frequency being different from the second selected radio communication frequency.

6. The test system according to claim 5, wherein the wireless probe card comprises a plurality of wireless units and the semiconductor material wafer comprises a wireless communication unit for each die, each of the plurality of wireless units being configured to be put in a one to one relationship with a corresponding wireless communication unit.

7. The test system according to claim 6, wherein each wireless unit and each wireless communication unit comprises a corresponding at least one transceiver or transponder adapted to wirelessly exchange test signals.

8. The test system according to claim 6, wherein each wireless unit and each wireless communication unit comprises at least one antenna.

9. The test system according to claim 8, wherein the at least one antenna comprises at least one capacitive antenna.

10. The test system according to claim 8, wherein the at least one antenna comprises at least one inductive antenna.

11. The test system according to claim 6, wherein each wireless unit and each wireless communication unit comprises at least one first antenna having a first size, and at least one second antenna having a second size.

12. The test system according to claim 11, wherein the first size is different from the second size.

13. The test system according to claim 11, wherein the first size is equal to the second size.