RF integrated circuit test methodology and system
First Claim
1. A system for testing a microelectronic die or package/module device under test (DUT) that has a millimeter wave antenna, comprising:
- an interface printed wiring board having a first face and a second face on a side opposite the first face, an area in the interface board through which transmission and reception of millimeter wave radiation occurs between the first face to the second face, and a plurality of contact points on the first face outside the area that are to contact matching ones of a connection board onto which the DUT has been installed, to transmit and/or receive signals for testing the DUT; and
a test antenna facing the second face of the interface board and being adapted to receive and/or transmit millimeter wave radiation through the area, from and/or to the antenna of the DUT.
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Accused Products
Abstract
Over the air or radiated testing of an RF microelectronic or integrated circuit device under test (DUT) that has an integrated millimeter wave (mmw) antenna structure, is described. The antenna structure may have multiple elements in an array design that may be driven and/or sensed by integrated RF transmitter and/or receiver circuitry. An interface printed wiring board (e.g., a tester load board or a wafer probe card assembly) has formed in it a mmw radiation passage that is positioned to pass mmw radiation to and/or from the integrated antenna of the DUT. Test equipment may be conductively coupled to contact points of the interface board, to transmit and/or receive signals for testing of the DUT and/or provide dc power to the DUT. A test antenna is designed and positioned to receive and/or transmit mmw radiation through the passage, from and/or to the integrated DUT antenna. Other embodiments are also described and claimed.
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Citations
25 Claims
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1. A system for testing a microelectronic die or package/module device under test (DUT) that has a millimeter wave antenna, comprising:
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an interface printed wiring board having a first face and a second face on a side opposite the first face, an area in the interface board through which transmission and reception of millimeter wave radiation occurs between the first face to the second face, and a plurality of contact points on the first face outside the area that are to contact matching ones of a connection board onto which the DUT has been installed, to transmit and/or receive signals for testing the DUT; and a test antenna facing the second face of the interface board and being adapted to receive and/or transmit millimeter wave radiation through the area, from and/or to the antenna of the DUT. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for testing a microelectronic die or package/module device under test (DUT) that has an RF antenna, comprising:
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installing the DUT to a first printed wiring board so that a temporary electrical connection is made between a plurality of pins of the DUT and a first plurality of contact points of the first board, respectively; bringing the first board, with the installed DUT, towards a second printed wiring board until a temporary electrical connection is made between a second plurality of contact points of the first board and a plurality of contact points on the second board, respectively; and
, while the temporary connections are there, performing a test of the DUT bya) sending conducted test signals to the installed DUT via the plurality of contact points of the second board and receiving associated radiated test signals radiated by the RF antenna of the installed DUT, and/or b) radiating RF test signals to the RF antenna of the installed DUT and receiving associated conducted test signals from the installed DUT via the plurality of contact points of the second board. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method for testing a microelectronic die or package/module device under test (DUT) that has an RF antenna, comprising:
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installing the DUT to a first printed wiring board so that a temporary electrical connection is made between a plurality of contact points of the first board and a plurality of pins of the DUT, respectively; and
, while the temporary connections are there, performing a test of the DUT bya) sending conducted test signals to the installed DUT via the plurality of contact points of the first board and receiving associated radiated test signals through an RF radiation passage in the first board, wherein the test signals are radiated by the RF antenna of the installed DUT, and/or b) radiating RF test signals through the RF radiation passage in the first board, to the RF antenna of the installed DUT and receiving associated conducted test signals from the installed DUT via the plurality of contact points of the first board.
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Specification