Radio frequency identification (RFID) tag and manufacturing method thereof

• US 7,916,032 B2
• Filed: 01/22/2008
• Issued: 03/29/2011
• Est. Priority Date: 08/13/2004
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Hayashi, Hiroyuki, Kai, Manabu, Baba, Shunji, Maniwa, Toru, Yamagajo, Takashi
• Primary Examiner(s): Previl; Daniel
• Application Number:
  US12/017,887
• Publication Number:
  US 20080122630A1
• Time in Patent Office: 1,162 Days
• Field of Search: 340/572.7, 3405721-5726, 3405728-5729, 340/10.1, 340/10.4, 340/540, 340/568.1
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads.

Claims

1. An RFID tag comprising:

a dielectric member substrate that is a plastic substrate;

an RFID tag antenna formed on at least three surfaces of the dielectric member substrate wrapping around the dielectric member substrate; and

an IC chip with a built-in communication circuit and a built-in memory circuit, the IC chip being electrically connected to the RFID tag antenna.

2. The RFID tag according to claim 1, wherein the RFID tag has increased communication, effective range, decreased tag size, and reduced interference from an attachment surface.

3. An RFID tag comprising:

a dielectric member substrate that is a plastic substrate;

a film substrate that includes an RFID tag antenna pattern, the film substrate being wrapped around at least three surfaces of the dielectric member substrate surrounding the dielectric member substrate; and

an IC chip with a built-in communication circuit and a built-in memory circuit, the IC chip being electrically connected to the RFID tag antenna pattern.

4. The RFID tag according to claim 3, wherein the RFID tag has increased communication, effective range, decreased tag size, and reduced interference from an attachment surface.

5. An RFID tag manufacturing method comprising:

forming an RFID tag loop antenna on at least three surfaces of a dielectric member substrate that is a plastic substrate, so that the RFID tag loop antenna wraps around the dielectric member substrate; and

electrically connecting an IC chip to the RFID tag loop antenna, the IC chip including a built-in communication circuit and a built-in memory circuit.

6. The RFID tag according to claim 5, wherein the RFID tag has increased communication, effective range, decreased tag size, and reduced interference from an attachment surface.