×

Lead assembly including a polymer interconnect and methods related thereto

  • US 7,917,229 B2
  • Filed: 08/31/2006
  • Issued: 03/29/2011
  • Est. Priority Date: 08/31/2006
  • Status: Active Grant
First Claim
Patent Images

1. A lead assembly comprising a lead proximal end portion and a lead distal end portion, the lead proximal end portion adapted to be coupled to an implantable medical device, the lead assembly comprising:

  • a ring component located distal to the lead proximal end portion, the ring component having an outer surface including mechanical coupling features around at least a portion of the ring component;

    at least one cylindrical polymer component having an inner surface mechanically coupled with the mechanical coupling features on the outer surface of the ring component;

    a lead body extending from the lead proximal end portion to the lead distal end portion, the lead body comprising an elongate tubing defining an outer surface of the lead and having an inner surface fused with the outer surface of the polymer component such that the elongate tubing is in direct contact with the outer surface of the polymer component;

    at least one conductor disposed within the elongate tubing, the at least one conductor extending from the proximal end portion towards the distal end portion of the lead; and

    at least one electrode disposed on the lead body and electrically coupled with the at least one conductor.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×