Packaging method for light emitting diode module that includes fabricating frame around substrate

• US 7,919,339 B2
• Filed: 09/08/2008
• Issued: 04/05/2011
• Est. Priority Date: 09/08/2008
• Status: Expired due to Fees

• Current Assignee: Chi-Yuan Hsu, Iledm Photoelectronics, Inc. (Trendforce Corp.)
• Original Assignee: Chi-Yuan Hsu, Iledm Photoelectronics, Inc. (Trendforce Corp.)
• Inventors: Hsu, Chi-Yuan
• Primary Examiner(s): Smoot; Stephen W
• Application Number:
  US12/206,523
• Publication Number:
  US 20100059770A1
• Time in Patent Office: 939 Days
• Field of Search: 438/28
• US Class Current: 438/28
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A packaging method for light emitting diode module that includes fabricating frame around substrate, wherein the method comprises the steps of: fabricating a printed circuit layer with a plurality of staggered nodes on a substrate; fabricating a frame around the substrate; fabricating a protruding inclined pier around the bottom rim of the inner wall of the frame; fabricating a plurality of convex reflecting microstructure points on the surface of the printed circuit layer; positioning chips and wire bonding; spraying reflecting paint on the surface of the substrate and the inner wall of the frame except the chips; filling a silica gel diffusion layer formed by mixing the silica gel and the diffusion powder into the frame; and evenly coating a fluorescent glue layer formed by evenly mixing another silica gel and fluorescent powder on the silica gel diffusion layer.

Claims

1. A packaging method for a light emitting diode module comprising the steps of:

fabricating a printed circuit layer on a substrate and fabricating a plurality of staggered nodes on the printed circuit layer;

fabricating a frame around the substrate;

fabricating convex reflecting microstructure points, and then fixing them by roasting;

positioning chips and wire bonding;

positioning chips in a staggered manner, and then fixing them by roasting;

dispensing;

filling a silica gel diffusion layer into the frame, and then fixing it by roasting; and

fabricating a fluorescent glue layer;

evenly coating a fluorescent glue layer on a surface of the silica gel diffusion layer.

2. The packaging method for a light emitting diode module as claimed in claim 1 further comprising the step of:

precisely spraying reflecting paint on the substrate, wires and the nodes, excluding the chips.

3. A packaging method for light emitting diode module that includes fabricating frame around substrate, comprising the steps of:

fabricating a printed circuit layer on a substrate;

fabricating a frame and a protruding inclined pier;

fixing a frame around the substrate, and around a bottom rim of an inner wall of the frame is disposed a protruding inclined pier;

fabricating reflecting microstructure points;

fabricating a plurality of reflecting microstructure points on a surface of the printed circuit layer;

positioning chips and wire bonding;

dispensing;

filling a silica gel diffusion layer into the frame; and

fabricating a fluorescent glue layer;

coating an even fluorescent glue layer on a surface of the silica gel diffusion layer.

4. The packaging method for light emitting diode module that includes fabricating frame around substrate as claimed in claim 3, wherein the respective reflecting microstructure points are correspondingly disposed between the respective chips and then are fixed by roasting in the step of fabricating reflecting microstructure points;

further a fixing by roasting operation is performed after the step of positioning chips and wire bonding.

5. The packaging method for light emitting diode module that includes fabricating frame around substrate as claimed in claim 3, wherein the protruding inclined pier is formed by using a precision dispensing machine to make glue flow down after adhesion along an upper rim of the inner wall of the frame, and is used to defeat a peripheral capillarity of the silica gel diffusion layer during dispensing.

6. A packaging method for light emitting diode module that includes fabricating frame around substrate, comprising the steps of:

fabricating a printed circuit layer on a substrate, fabricating a plurality of staggered nodes on the printed circuit layer;

fabricating a frame and an inclined pier;

fixing a frame around the substrate, and fabricating a protruding inclined pier around a bottom rim of an inner wall of the frame;

fabricating convex reflecting microstructure points;

fabricating a plurality of convex reflecting microstructure points on a surface of the printed circuit layer, and the respective convex reflecting microstructure points are correspondingly disposed between the plurality of nodes;

positioning chips and wire bonding;

precisely spraying reflecting paint on predetermined elements, excluding the chips;

dispensing;

filling a silica gel diffusion layer into the frame; and

fabricating a fluorescent glue layer;

coating an even fluorescent glue layer on a surface of the silica gel diffusion layer.

7. The packaging method for light emitting diode module that includes fabricating frame around substrate as claimed in claim 6, wherein the protruding inclined pier is formed by using a precision dispensing machine to make glue flow down after adhesion along an upper rim of the inner wall of the frame, and is used to defeat a peripheral capillarity of the silica gel diffusion layer during dispensing.