Microcrystalline silicon deposition for thin film solar applications
First Claim
1. A method of forming a thin film multi-junction solar cell over a substrate, comprising:
- forming a first p-i-n junction, comprising;
forming a p-type amorphous silicon layer over the substrate;
forming an intrinsic type amorphous silicon layer over the p-type amorphous silicon layer; and
forming a first n-type silicon layer over the intrinsic type amorphous silicon layer; and
forming a second p-i-n junction over the first p-i-n junction, comprising;
forming a p-type microcrystalline silicon layer;
forming an amorphous silicon barrier layer over the p-type microcrystalline silicon layer;
forming an intrinsic type microcrystalline silicon layer over the amorphous silicon barrier layer, wherein forming the intrinsic type microcrystalline silicon layer comprises;
forming a first region of the intrinsic type microcrystalline silicon layer at a first deposition rate;
forming a second region of the intrinsic type microcrystalline silicon layer over the first region of the intrinsic type microcrystalline silicon layer at a second deposition rate higher than the first deposition rate; and
forming a third region of the intrinsic type microcrystalline silicon layer over the second region of the intrinsic type microcrystalline silicon layer at a third deposition rate lower than the second deposition rate; and
forming a second n-type silicon layer over the intrinsic type microcrystalline layer.
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Accused Products
Abstract
Embodiments of the invention as recited in the claims relate to thin film multi-junction solar cells and methods and apparatuses for forming the same. In one embodiment a method of forming a thin film multi-junction solar cell over a substrate is provided. The method comprises positioning a substrate in a reaction zone, providing a gas mixture to the reaction zone, wherein the gas mixture comprises a silicon containing compound and hydrogen gas, forming a first region of an intrinsic type microcrystalline silicon layer on the substrate at a first deposition rate, forming a second region of the intrinsic type microcrystalline silicon layer on the substrate at a second deposition rate higher than the first deposition rate, and forming a third region of the intrinsic type microcrystalline silicon layer on the substrate at a third deposition rate lower than the second deposition rate.
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Citations
20 Claims
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1. A method of forming a thin film multi-junction solar cell over a substrate, comprising:
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forming a first p-i-n junction, comprising; forming a p-type amorphous silicon layer over the substrate; forming an intrinsic type amorphous silicon layer over the p-type amorphous silicon layer; and forming a first n-type silicon layer over the intrinsic type amorphous silicon layer; and forming a second p-i-n junction over the first p-i-n junction, comprising; forming a p-type microcrystalline silicon layer; forming an amorphous silicon barrier layer over the p-type microcrystalline silicon layer; forming an intrinsic type microcrystalline silicon layer over the amorphous silicon barrier layer, wherein forming the intrinsic type microcrystalline silicon layer comprises; forming a first region of the intrinsic type microcrystalline silicon layer at a first deposition rate; forming a second region of the intrinsic type microcrystalline silicon layer over the first region of the intrinsic type microcrystalline silicon layer at a second deposition rate higher than the first deposition rate; and forming a third region of the intrinsic type microcrystalline silicon layer over the second region of the intrinsic type microcrystalline silicon layer at a third deposition rate lower than the second deposition rate; and forming a second n-type silicon layer over the intrinsic type microcrystalline layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of forming a thin film multi-junction solar cell over a substrate, comprising:
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forming a first p-i-n junction, comprising; forming a p-type amorphous silicon layer over the substrate; forming an intrinsic type amorphous silicon layer over the p-type amorphous silicon layer; and forming a first n-type silicon layer over the intrinsic type amorphous silicon layer; and forming a second p-i-n junction over the first p-i-n junction, comprising; forming a p-type microcrystalline silicon layer; forming an intrinsic type microcrystalline silicon layer over the p-type microcrystalline silicon layer, wherein forming the intrinsic type microcrystalline silicon layer comprises; forming a seed layer over the p-type microcrystalline silicon layer; forming a first region of the intrinsic type microcrystalline silicon layer at a first deposition rate; forming a second region of the intrinsic type microcrystalline silicon over the first region of the intrinsic type microcrystalline silicon layer at a second deposition rate higher than the first deposition rate; and forming a third region of the intrinsic type microcrystalline silicon layer over the second region of the intrinsic type microcrystalline silicon layer at a third deposition rate lower than the second deposition rate; and forming a second n-type silicon layer over the intrinsic type microcrystalline layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification