Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same
First Claim
1. A Group III-V nitride microelectronic device structure comprising a high electron mobility transistor (HEMT) having a delta doped layer located in a barrier layer that is adjacent to a channel layer that provides a selectively operable conductive path between a source contact and a drain contact of the HEMT, wherein:
- said barrier layer comprises a nitride of a metal or metal alloy that is compositionally different or stoichiometrically different from a nitride of a metal or metal alloy of the channel layer, with the barrier layer having a bandgap greater than a bandgap of the channel layer, andsaid delta doped layer and said channel layer are spaced apart by a distance of less than or equal to about 30 Angstroms.
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Abstract
A Group III-V nitride microelectronic device structure including a delta doped layer and/or a doped superlattice. A delta doping method is described, including the steps of: depositing semiconductor material on a substrate by a first epitaxial film growth process; terminating the deposition of semiconductor material on the substrate to present an epitaxial film surface; delta doping the semiconductor material at the epitaxial film surface, to form a delta doping layer thereon; terminating the delta doping; resuming deposition of semiconductor material to deposit semiconductor material on the delta doping layer, in a second epitaxial film growth process; and continuing the semiconductor material second epitaxial film growth process to a predetermined extent, to form a doped microelectronic device structure, wherein the delta doping layer is internalized in semiconductor material deposited in the first and second epitaxial film growth processes.
218 Citations
18 Claims
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1. A Group III-V nitride microelectronic device structure comprising a high electron mobility transistor (HEMT) having a delta doped layer located in a barrier layer that is adjacent to a channel layer that provides a selectively operable conductive path between a source contact and a drain contact of the HEMT, wherein:
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said barrier layer comprises a nitride of a metal or metal alloy that is compositionally different or stoichiometrically different from a nitride of a metal or metal alloy of the channel layer, with the barrier layer having a bandgap greater than a bandgap of the channel layer, and said delta doped layer and said channel layer are spaced apart by a distance of less than or equal to about 30 Angstroms. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A microelectronic device structure comprising a high electron mobility transistor (HEMT) including:
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a source contact and a drain contact; a Group III-V nitride channel layer that provides a selectively operable conductive path between the source contact and the drain contact; a gate element adapted to regulate flow of current through the channel layer; and a Group III-V nitride barrier layer adjacent to the channel layer, the barrier layer having a bandgap that is greater than a bandgap of the channel layer; wherein a delta doped layer is defined within the barrier layer, and the delta doped layer is spaced apart from the channel layer by a distance of less than or equal to about 30 Angstroms. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification