Power distribution for high-speed integrated circuits
First Claim
1. An electronic assembly, comprising:
- a circuit board;
an integrated circuit attached to a top side of the printed circuit board;
a plurality of decoupling capacitors connected to the top side of the printed circuit board around a perimeter of the integrated circuit, the plurality of decoupling capacitors providing charge current to the integrated circuit;
a via fence surround the plurality of decoupling capacitors;
a first ground layer disposed below a bottom side of the circuit board;
a power layer disposed below the first ground layer;
a second ground layer disposed between the first ground layer and the power layer, the second ground layer extends widthwise between the via fence;
the circuit board including an inner dielectric layer comprising (i) a first material having a dielectric constant of approximately 12.5, and (ii) a second material having a dielectric constant of approximately 3;
the second material extending heightwise between a bottom side of the second ground layer and a top side of the power layer and widthwise between the via fence; and
the first material surrounding the second material, the first material forming at least a volume extending heightwise between the first ground layer and the second ground layer and widthwise between the via fence.
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Accused Products
Abstract
An improved technique for power distribution for use by high speed integrated circuit devices. A mixture of high dielectric constant, Er and low Er materials are used in a dielectric layer sandwiched between the voltage and ground planes of a printed circuit board that is used to fixture one or more integrated circuit devices. The low Er material is used in an area contained by the location of the integrated circuit device and its corresponding decoupling capacitors located nearby. High Er material is used in areas between the regions of low Er material. The low Er material improves that speed at which current from an adjoining decoupling capacitor can propagate to a power pin of the integrated circuit device. The high Er material mitigates cross-coupling of noise between the low Er regions.
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Citations
14 Claims
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1. An electronic assembly, comprising:
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a circuit board; an integrated circuit attached to a top side of the printed circuit board; a plurality of decoupling capacitors connected to the top side of the printed circuit board around a perimeter of the integrated circuit, the plurality of decoupling capacitors providing charge current to the integrated circuit; a via fence surround the plurality of decoupling capacitors; a first ground layer disposed below a bottom side of the circuit board; a power layer disposed below the first ground layer; a second ground layer disposed between the first ground layer and the power layer, the second ground layer extends widthwise between the via fence; the circuit board including an inner dielectric layer comprising (i) a first material having a dielectric constant of approximately 12.5, and (ii) a second material having a dielectric constant of approximately 3; the second material extending heightwise between a bottom side of the second ground layer and a top side of the power layer and widthwise between the via fence; and the first material surrounding the second material, the first material forming at least a volume extending heightwise between the first ground layer and the second ground layer and widthwise between the via fence. - View Dependent Claims (2, 3)
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4. An electronic assembly comprising:
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a first ground layer comprising an electrically conductive material; a second ground layer comprising the electrically conductive material; a power layer comprising the electrically conductive material; a first integrated circuit mounted on a top surface above the first ground layer having at least one pin electrically connected to the power layer and at least one pin electrically connected to the second ground layer, the at least one pin electrically connected to the second ground layer defining a first power node; at least a first decoupling capacitor mounted on the top surface with the first integrated circuit, the at least the first decoupling capacitor having at least one pin connected to the power layer and at least one pin electrically connected to the second ground layer, the at least one pin connected to the power layer defining a second power node and providing charge current to the first integrated circuit; a dielectric layer having at least two separate regions, with a first region consisting of a higher dielectric material than a second region consisting of a lower dielectric material, a dielectric differential between the higher and lower dielectrics being greater than 1; wherein the second region is approximately equal to a length of the second ground layer and disposed between the second ground layer and the power layer such that the lower dielectric material is disposed between the first and second power nodes; and wherein the first region consisting of the higher dielectric material is disposed between the second ground layer and the first ground layer and around the second region and the second ground layer. - View Dependent Claims (5, 6, 7, 8)
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9. An electronic assembly comprising:
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an integrated circuit (IC) device connected to a ground plane and a power plane, the IC device characterized as having an outer peripheral that defines an IC footprint, the IC footprint defining a first area approximately equal to a length of the IC device times a width of the IC device; a plurality of decoupling capacitors laterally adjacent to the IC device, the plurality of decoupling capacitors connected between the ground plane and the power plane to supply charge current to the IC device, the plurality of decoupling capacitors being disposed around the IC device to define a second area approximately equal to the first area plus additional area around the first area sufficient to encompass the IC footprint and the decoupling capacitors; wherein the ground plane is comprised of planar first and second conducting layers, the first conducting layer being parallel to the second conducting layer, the first conducting layer being offset a first distance above the second conducting layer, the first conducting layer having a third area that aligns with and is larger than the second area, the second conducting layer having a fourth area that aligns with and is approximately equal to the second area; wherein the power plane is comprised of a planar third conducting layer, the third conducting layer being parallel to the first and second conducting layers and offset a third distance below the second conducting layer, the third conducting layer having a fifth area that aligns with and is at least as large as the first conducting layer; a low Er dielectric layer laminated to each of a top side of the third conducting layer and a bottom side of the second conducting layer, the low Er dielectric layer filling a first volume between the second conducting layer and the third conducting layer with low Er material, wherein a side of the first volume of the low Er material is defined as extending from the second conducting to the third conducting layer; a high Er dielectric layer laminated to each of the top side of the third conducting layer, a top side of the second conducting layer, a bottom side of the first conducting material, and the side of the first volume of the low Er material, the high Er dielectric layer filling an second volume between the first conducting layer and the third conducting layer with high Er material; the low dielectric layer having a dielectric constant of at least 1; the high dielectric layer having a dielectric constant greater than one times the dielectric constant of the low dielectric layer. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification