×

Tier structure with tier frame having a feedthrough structure

  • US 7,919,844 B2
  • Filed: 09/20/2006
  • Issued: 04/05/2011
  • Est. Priority Date: 05/26/2005
  • Status: Active Grant
First Claim
Patent Images

1. A tier structure comprising:

  • a tier frame including a first tier side, a second tier side, a feedthrough structure, and an integrated circuit die comprising an I/O pad, wherein the feedthrough structure comprises a conductive structure including a photoresist, wherein the conductive structure is configured to route electrical signals through the tier frame, and wherein the I/O pad is electrically connected to the conductive structure by a conductive trace; and

    an exposed electrically-conductive pad disposed on the first or second tier side, wherein the exposed electrically-conductive pad is electrically connected to the conductive structure.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×