Method for making arrangement for energy conditioning

• US 7,920,367 B2
• Filed: 03/29/2010
• Issued: 04/05/2011
• Est. Priority Date: 04/08/1997
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony A., Anthony, William M.
• Primary Examiner(s): Jackson; Stephen W
• Application Number:
  US12/749,040
• Publication Number:
  US 20100180438A1
• Time in Patent Office: 372 Days
• Field of Search: 361/118
• US Class Current: 361/118
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: H05K 9/0071 Active shielding
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49194 Assembling elongated conductors, e.g., splicing, etc.

Abstract

Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Claims

1. A method of making an energy pathway arrangement, comprising:

conductively coupling to one another a first conductor including a first conductive plane area, a third conductor including a third conductive plane area, and a fifth conductor including a fifth conductive plane area;

electrically insulating from each other a second conductor including a second plane area and a fourth conductor including a fourth conductive plane area;

wherein a portion of said second area is substantially the same size as a portion of said fourth area, and wherein said third area is larger than said portion of said second area;

positioning said portion of said second area in a first position between said first area and said third area and substantially parallel with said first area, said third area, said portion of said fourth area and said fifth area;

positioning said portion of said fourth area in a second position between said third area and said fifth area and substantially parallel with said first area, said portion of said second area, said third area, and said fifth area; and

orienting said portion of said second area to face said portion of said fourth area, wherein said portion of said second area and said portion of said fourth area are shielded from each other by said third area.

2. The method of claim 1, further comprising:

aligning said portion of said second area to substantially superpose with said portion of said fourth area.

3. The method of claim 1, further comprising:

spacing said portion of said second area apart from said third area by a first distance, and spacing said portion of said fourth area apart from said third area by a second distance; and

wherein said first distance is substantially the same as said second distance.

4. The method of claim 2, further comprising:

spacing said portion of said second area apart from said third area by a first distance, and spacing said portion of said fourth area apart from said third area by a second distance; and

wherein said first distance is substantially the same as said second distance.

5. The method of claim 4, further comprising:

conductively coupling an integrated circuit chip to said second conductor.

6. The method of claim 3, further comprising:

electrically insulating said second conductor and said fourth conductor from said first conductor, said third conductor and said fifth conductor;

providing a sixth conductor including a sixth conductive plane area;

providing a seventh conductor including a seventh conductive plane area;

providing an eighth conductor including an eighth conductive plane area;

providing a ninth conductor including a ninth conductive plane area;

providing a tenth conductor including a tenth conductive plane area; and

electrically insulating said second conductor and said fourth conductor from said seventh conductor and said ninth conductor.

7. The method of claim 4, further comprising:

electrically insulating said first conductor, said third conductor and said fifth conductor from said second conductor and said fourth conductor.

8. The method of claim 7, further comprising:

conductively coupling an integrated circuit chip to said second conductor.

9. The method of claim 5, further comprising:

conductively coupling said integrated circuit chip to said fourth conductor.

10. The method of claim 6, further comprising:

aligning said first position of said portion of said second area to overlap with and said second position of said portion of said fourth area.

11. A method of making an energy pathway arrangement, comprising:

conductively coupling to one another a first conductor comprising a first conductive plane area, a third conductor comprising a third conductive plane area, and a fifth conductor comprising a fifth conductive plane area;

electrically insulating said third conductor and said fifth conductor from a second conductor comprising a second conductive plane area and a fourth conductor comprising a fourth conductive plane area;

wherein said third conductive plane area has a portion of said third conductive plane area that includes a first side of said portion of said third conductive plane area and a second side of said portion of said third conductive plane area;

providing a sixth conductor comprising a sixth conductive plane area;

providing a seventh conductor comprising a seventh conductive plane area;

providing an eighth conductor comprising an eighth conductive plane area;

providing a ninth conductor comprising a ninth conductive plane area;

providing a tenth conductor comprising a tenth conductive plane area;

spacing a portion of said second area a first distance from said first side of said portion of said third area, positioning said portion of said second area between a portion of said first area and said first side of said portion of said third area, and orienting said portion of said second area to be substantially parallel with said portion of said first area, said first side of said portion of said third area, said second side of said portion of said third area, a portion of said fourth area, and a portion of said fifth area;

spacing said portion of said fourth area a second distance from said second side of said portion of said third area, positioning said portion of said fourth area between said portion of said fifth area and said second side of said portion of said third area, and orienting said portion of said fourth area to be substantially parallel with said portion of said first area, said portion of said second area, said first side of said portion of said third area, said second side of said portion of said third area, and said portion of said fifth area;

wherein said first distance is substantially the same as said second distance;

orienting said portion of said second area and said portion of said fourth area to face each other, wherein said portion of said second area is shielded from said portion of said fourth area by said first side of said portion of said third area and said second side of said portion of said third area.

12. The method of claim 11, further comprising:

electrically insulating said first conductor, said third conductor and said fifth conductor from said seventh conductor and said ninth conductor.

13. The method of claim 12, further comprising:

electrically insulating said second conductor and said fourth conductor from each other.

14. The method of claim 13, further comprising:

arranging said portion of said second area and said portion of said fourth area in a substantially superposed alignment with each other.

15. The method of claim 13, further comprising:

conductively coupling said seventh conductor and said ninth conductor to each other.

16. The method of claim 14, further comprising:

conductively coupling an integrated circuit chip to said second conductor.

17. The method of claim 16, wherein said first side of said portion of said third area is larger than said portion of said second area, and wherein said second side of said portion of said third area is larger than said portion of said fourth area.

18. The method of claim 11, further comprising:

positioning said portion of said second area in a first position relative to said portion of said fourth area, positioning said portion of said fourth area in a second position relative to said portion of said second area, wherein said first position of said portion of said second area overlaps said second position of said portion of said fourth area; and

wherein said first side of said portion of said third area is larger than said portion of said second area, and wherein said second side of said portion of said third area is larger than said portion of said fourth area, and wherein said portion of said second area is substantially the same size as said portion of said fourth area.

19. The method of claim 18, further comprising:

conductively coupling an integrated circuit chip to said second conductor; and

conductively coupling said integrated circuit chip to said fourth conductor.

20. A method of making a substrate for an integrated circuit chip, comprising:

making an energy pathway arrangement, comprising;

positioning under a first surface of said substrate a first conductor including a first conductive plane area;

positioning between said first area and said first surface a second conductor that includes a second conductive plane area, wherein said second area is above said first area;

positioning between said second area and said first surface a third conductor that includes a third conductive plane area, wherein said third area is above said second area;

positioning between said third area and said first surface a fourth conductor including a fourth conductive plane area, wherein said fourth area is above said third area;

positioning between said fourth area and said first surface a fifth conductor including a fifth conductive plane area, wherein said fifth area is above said fourth area;

conductively coupling said first conductor, said third conductor and said fifth conductor to one another;

electrically insulating said first conductor, said third conductor and said fifth conductor from said second conductor and said fourth conductor;

electrically insulating said second conductor and said fourth conductor from each other;

arranging a portion of said second area substantially parallel with a portion of said first area, a portion of said third area, a portion of said fourth area, and a portion of said fifth area;

arranging a portion of said fourth area substantially parallel with said portion of said first area, said portion of said third area, and said portion of said fifth area;

wherein said portion of said second area is substantially the same size as said portion of said fourth area, and wherein said portion of said second area is shielded from said portion of said fourth area by said portion of said third area;

orienting said portion of said second area and said portion of said fourth area to face each other;

arranging said portion of said second area and said portion of said fourth area in substantially superposed alignment with each other; and

making said second conductor operable for conductive connection to a first part of an integrated circuit chip, and making said fourth conductor operable for conductive connection to a second part of said integrated circuit chip.