Mask-pattern determination using topology types
First Claim
1. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, comprising:
- determining, by a computer, a set of regions corresponding to different locations on a target pattern;
representing a first mask pattern with a pixel based representation;
determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining includes different treatment for different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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Accused Products
Abstract
A method for determining a mask pattern is described. During the method, a first mask pattern that includes a plurality of second regions corresponding to the first regions of the photo-mask is provided. Then, a second mask pattern is determined based on the first mask pattern and differences between a target pattern and an estimate of a wafer pattern that results from the photolithographic process that uses at least a portion of the first mask pattern. Note that the determining includes different treatment for different types of regions in the target pattern, and the second mask pattern and the target pattern include pixilated images.
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Citations
25 Claims
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1. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, comprising:
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determining, by a computer, a set of regions corresponding to different locations on a target pattern; representing a first mask pattern with a pixel based representation; determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining includes different treatment for different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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2. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, comprising:
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determining, via the computer, a set of regions corresponding to different locations on a target pattern; representing a first mask pattern with a pixel based representation; determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A non-transitory computer-program product for use in conjunction with a computer system, the computer-program product comprising a computer-readable storage medium and a computer-program mechanism embedded therein for determining a mask pattern to be used on a photo-mask in a photolithographic process, the computer-program mechanism including:
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instructions for determining a set of regions corresponding to different locations on a target pattern; instructions for representing a first mask pattern with a pixel based representation; instructions for determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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22. A computer system, comprising:
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at least one processor; at least one memory; and at least one program module, the program module stored in the memory and configured to be executed by the processor, wherein at least the program module is for determining a mask pattern to be used on a photo-mask in a photolithographic process, the program module including; instructions for determining a set of regions corresponding to different locations on a target pattern; instructions for representing a first mask pattern with a pixel based representation; instructions for determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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23. A photo-mask for use in a photolithographic process, wherein a mask pattern to which the photo-mask corresponds is determined in a process including the operations of:
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determining, by a computer, a set of regions corresponding to different locations on a target pattern; representing a first mask pattern with a pixel based representation; determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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24. A semiconductor wafer, wherein the semiconductor wafer is produced in a photo-lithographic process that includes a photo-mask, wherein a mask pattern to which the photo-mask corresponds is determined in a process including the operations of:
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determining, by a computer, a set of regions corresponding to different locations on a target pattern; representing a first mask pattern with a pixel based representation; determining a second mask pattern in accordance with the first mask pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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25. A data file stored in a computer-readable memory, comprising information corresponding to a mask pattern, wherein the mask pattern corresponds to a photo-mask that is to print a wafer pattern in a semiconductor-manufacturing process, wherein the mask pattern is determined in a process that includes the operations of:
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determining, by a computer, a set of regions corresponding to different locations on a target pattern; representing a first pattern with a pixel based representation; determining a second pattern in accordance with the first pattern, the target pattern and a model of a photolithographic process, wherein the determining is dependent upon at least one parameter, wherein the value of the parameter is different for the different regions in the set of regions, wherein the determining involves an inverse optical calculation in which the second mask pattern in the model of the photolithographic process is calculated based on the model of the photolithographic process and information in an image at an output of the model of the photolithographic process, wherein determining the second mask pattern involves a rectilinear-projection operation having a minimum segment length, and wherein the rectilinear-projection operation conserves an area of features in the second mask pattern.
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Specification