Methods of fabricating vertical JFET limited silicon carbide metal-oxide semiconductor field effect transistors
First Claim
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1. A method of fabricating a silicon carbide metal-oxide semiconductor field effect transistor unit cell comprising:
- providing an n-type silicon carbide drift layer;
providing a first p-type silicon carbide region adjacent the drift layer;
providing a first n-type silicon carbide region within the first p-type silicon carbide region;
providing an oxide layer adjacent the drift layer; and
providing an n-type silicon carbide limiting region between the drift layer and a portion of the first p-type silicon carbide region, wherein the n-type limiting region comprises a first portion laterally extending along a floor of the first p-type silicon carbide region and a second portion disposed adjacent to a sidewall of the first p-type silicon carbide region,wherein the n-type limiting region has a carrier concentration that is greater than a carrier concentration of the drift layer, and wherein the first portion has a carrier concentration greater than a carrier concentration of the second portion.
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Abstract
Silicon carbide metal-oxide semiconductor field effect transistors (MOSFETs) may include an n-type silicon carbide drift layer, a first p-type silicon carbide region adjacent the drift layer and having a first n-type silicon carbide region therein, an oxide layer on the drift layer, and an n-type silicon carbide limiting region disposed between the drift layer and a portion of the first p-type region. The limiting region may have a carrier concentration that is greater than the carrier concentration of the drift layer. Methods of fabricating silicon carbide MOSFET devices are also provided.
121 Citations
26 Claims
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1. A method of fabricating a silicon carbide metal-oxide semiconductor field effect transistor unit cell comprising:
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providing an n-type silicon carbide drift layer; providing a first p-type silicon carbide region adjacent the drift layer; providing a first n-type silicon carbide region within the first p-type silicon carbide region; providing an oxide layer adjacent the drift layer; and providing an n-type silicon carbide limiting region between the drift layer and a portion of the first p-type silicon carbide region, wherein the n-type limiting region comprises a first portion laterally extending along a floor of the first p-type silicon carbide region and a second portion disposed adjacent to a sidewall of the first p-type silicon carbide region, wherein the n-type limiting region has a carrier concentration that is greater than a carrier concentration of the drift layer, and wherein the first portion has a carrier concentration greater than a carrier concentration of the second portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of fabricating a silicon carbide metal-oxide semiconductor field effect transistor, comprising the steps of:
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providing a drift layer of n-type silicon carbide; providing first regions of p-type silicon carbide adjacent the drift layer; providing a first region of n-type silicon carbide between peripheral edges of the first regions of p-type silicon carbide; providing second regions of n-type silicon carbide in the first regions of p-type silicon carbide, wherein the second regions of n-type silicon carbide have a carrier concentration greater than a carrier concentration of the drift layer and are spaced apart from the peripheral edges of the first regions of p-type silicon carbide; providing an oxide layer on the drift layer, the first region of n-type silicon carbide and the second regions of n-type silicon carbide; and providing third regions of n-type silicon carbide laterally extending along respective floors of the first regions of p-type silicon carbide and between the first regions of p-type silicon carbide and the drift layer, wherein the first and third regions of n-type silicon carbide define an n-type limiting region having a carrier concentration greater than the carrier concentration of the drift layer, wherein the first region of n-type silicon carbide has a higher carrier concentration than a carrier concentration of the drift layer and has a lower carrier concentration than the carrier concentration of the third regions of n-type silicon carbide; providing source contacts on portions of the second regions of n-type silicon carbide; providing a gate contact on the oxide layer; and providing a drain contact on the drift layer opposite the oxide layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of fabricating a silicon carbide metal-oxide semiconductor field effect transistor comprising:
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providing an n-type silicon carbide drift layer; providing spaced apart p-type silicon carbide well regions; and providing an n-type silicon carbide limiting region between the well regions and the drift layer, wherein the n-type limiting region comprises a first portion laterally extending along respective floors of the well regions and a second portion adjacent to respective sidewalls of the well regions, wherein the n-type limiting region has a carrier concentration higher than a carrier concentration of the drift layer, and wherein the first portion has a carrier concentration higher than a carrier concentration of the second portion. - View Dependent Claims (25, 26)
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Specification