Method of fabricating backside illuminated image sensor
First Claim
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1. A method for fabricating an electronic device, comprising:
- providing a substrate with a front surface and a back surface;
forming a first alignment mark for global alignment on the front surface of the substrate;
forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; and
removing a portion of the back surface of the substrate at the clear-out region tor locating the second alignment mark, wherein the removing includes performing registration from the back surface using the first alignment mark as a reference.
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Abstract
A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; aligning the substrate from the back surface using the first alignment mark; and removing a portion of the back surface of the substrate at the clear-out region for locating the second alignment mark.
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Citations
20 Claims
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1. A method for fabricating an electronic device, comprising:
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providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; and removing a portion of the back surface of the substrate at the clear-out region tor locating the second alignment mark, wherein the removing includes performing registration from the back surface using the first alignment mark as a reference. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for fabricating a back-side illuminated image sensor, comprising:
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providing a semiconductor substrate having a front surface, back surface, active region, and clear-out region; forming a first alignment mark on the front surface of the substrate; forming a second alignment mark on the front surface in the clear-out region; selectively etching a portion of the substrate from the back surface within the clear-out region by performing registration from the back surface and using the first alignment mark as a reference; and processing the active region of the substrate from the back surface by performing registration from the back surface and using the second alignment mark as a reference. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification