Two-dimensional time delay integration visible CMOS image sensor
First Claim
Patent Images
1. A two dimensional time delay integration CMOS image sensor comprising:
- an array of pinned photodiodes including first and second pinned photodiodes, each pinned photodiode is configured to collect a charge when light strikes the pinned photodiode; and
a plurality of electrodes located around a perimeter of each pinned photodiode to form a grid, the plurality of electrodes including;
a first electrode located adjacent to the first pinned photodiode, and configured to create a first well for receiving the charge from the first pinned photodiode, anda second electrode located adjacent to the first electrode and the second pinned photodiode, the second electrode configured to create a second well adjacent to the first well, cooperate with the first electrode for transferring the charge from the first well to the second well, and transfer the charge from the second well to the second pinned photodiode.
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Abstract
A two dimensional time delay integration CMOS image sensor having a plurality of pinned photodiodes, each pinned photodiode collects a charge when light strikes the pinned photodiode, a plurality of electrodes separating the plurality of pinned photodiodes, the plurality of electrodes are configured for two dimensional charge transport between two adjacent pinned photodiodes, and a plurality of readout nodes connected to the plurality of pinned photodiodes via address lines.
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Citations
14 Claims
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1. A two dimensional time delay integration CMOS image sensor comprising:
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an array of pinned photodiodes including first and second pinned photodiodes, each pinned photodiode is configured to collect a charge when light strikes the pinned photodiode; and a plurality of electrodes located around a perimeter of each pinned photodiode to form a grid, the plurality of electrodes including; a first electrode located adjacent to the first pinned photodiode, and configured to create a first well for receiving the charge from the first pinned photodiode, and a second electrode located adjacent to the first electrode and the second pinned photodiode, the second electrode configured to create a second well adjacent to the first well, cooperate with the first electrode for transferring the charge from the first well to the second well, and transfer the charge from the second well to the second pinned photodiode. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A two dimensional time delay integration CMOS image sensor comprising:
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a plurality of pinned photodiodes including first and second pinned photodiodes, each pinned photodiode generates a charge when light strikes the pinned photodiode; a plurality of electrodes separating the plurality of pinned photodiodes, the plurality of electrodes including; a first electrode located adjacent to the first pinned photodiode, and configured to create a first well for receiving the charge from the first pinned photodiode, and a second electrode located adjacent to the first electrode and the second pinned photodiode, the second electrode configured to create a second well adjacent to the first well, cooperate with the first electrode for transferring the charge from the first well to the second well, and transfer the charge from the second well to the second pinned photodiode; and a plurality of readout nodes connected to the plurality of pinned photodiodes via address lines. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification