Semiconductor devices including voltage switchable materials for over-voltage protection
First Claim
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1. A semiconductor device comprising:
- a dielectric substrate including, on a first surface thereof, a conductor;
a semiconductor die attached to the first surface using a die attach adhesive;
a voltage switchable material connecting the semiconductor die to the conductor, the voltage switchable material physically contacting both the semiconductor die and the conductor; and
an encapsulant that encapsulates the semiconductor die, wherein the encapsulant and the die attach adhesive include the voltage switchable material.
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Abstract
Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.
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Citations
9 Claims
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1. A semiconductor device comprising:
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a dielectric substrate including, on a first surface thereof, a conductor; a semiconductor die attached to the first surface using a die attach adhesive; a voltage switchable material connecting the semiconductor die to the conductor, the voltage switchable material physically contacting both the semiconductor die and the conductor; and an encapsulant that encapsulates the semiconductor die, wherein the encapsulant and the die attach adhesive include the voltage switchable material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification