Apparatus and methods for filament crimping and manufacturing

• US 7,926,520 B2
• Filed: 01/21/2010
• Issued: 04/19/2011
• Est. Priority Date: 06/22/2006
• Status: Active Grant

• Current Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Original Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Inventors: Foshansky, Leonid, Bogursky, Robert, Wood, Darrel II, Kennedy, Craig, Saunders, Mark
• Primary Examiner(s): Ekiert; Teresa M
• Application Number:
  US12/691,562
• Publication Number:
  US 20100119863A1
• Time in Patent Office: 453 Days
• Field of Search: 140/105, 140/106, 140/113, 723/06, 723/07, 72381-385, 292/38, 292/435.6, 292/63, 292/78
• US Class Current: 140/105
• CPC Class Codes: H01R 4/01 Connections using shape memory materials, e.g. shape memory metal
• CPC Class Codes: H01R 4/188 having an uneven wire-receiving surface to improve the contact
• CPC Class Codes: H01R 43/048 Crimping apparatus or processes H01R43/042 takes precedence
• CPC Class Codes: Y10T 29/49181 by deforming
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/5121 Wire working
• CPC Class Codes: Y10T 428/1241 Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]

Abstract

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Claims

1. A crimped filament assembly, comprising:

at least one crimp element assembly, said at least one crimp element assembly comprising;

a plurality of crimp heads, each of said crimp heads comprising a metal alloy with a plurality of crimping cavities therein, said plurality of crimping cavities adapted to retain a filament wire therein; and

a filament wire, said filament wire crimped to at least two of said crimp heads; and

a carrier comprising a plurality of locating features running in a direction substantially parallel with said filament wire, said carrier facilitating the automated processing of said at least one crimp element assembly.

2. The assembly of claim 1, wherein said crimp heads have at least one surface adapted for picking by a pick-and-place apparatus, and said carrier comprises a cover tape, said carrier having at least one aperture or notch formed therein in order to expose said at least one surface.

3. The assembly of claim 1, wherein said filament wire comprises a shape memory alloy, and said crimping cavities are disposed to form a substantially serpentine channel that receive at least a portion of said filament wire.

4. The assembly of claim 3, wherein said filament wire comprises a Nickel-Titanium shape memory alloy, and said crimp heads comprise a material having a hardness less than that of said shape memory alloy so as to preclude substantial deformation of said filament wire alloy during crimping.

5. The assembly of claim 1, wherein said carrier is configured to maintain at least one dimension of said crimp element assembly for subsequent processing.

6. The assembly of claim 5, wherein said at least one dimension comprises a spacing between two components.

7. The assembly of claim 1, wherein said carrier runs adjacent at least a portion of said filament wire, said adjacent portion of said carrier protecting said filament wire during product transport.

8. A method for manufacturing a crimped filament assembly comprising a plurality of crimp elements, the method comprising:

disposing a filament wire proximate at least one of said plurality of crimp elements;

placing said filament wire under tension;

crimping said filament wire under tension to said at least one crimp elements to form a crimped assembly; and

placing said crimped assembly onto a carrier, said crimped assembly on said carrier comprising said crimped filament assembly;

wherein said act of placing said crimped assembly onto said carrier comprises placing said crimped assembly such that said crimped assembly can be removed while disposed in a fixed location relative to said carrier.

9. The method of claim 8, wherein said crimping said filament wire under tension to said at least one crimp element comprises crimping at least two adjacent ones of said crimp elements.

10. The method of claim 8, further comprising maintaining a prescribed dimension between at least two of said plurality of crimp elements.

11. The method of claim 8, wherein said disposing comprises movably locating said filament wire into a crimp gap of said at least one crimp element.

12. The method of claim 8, wherein each of said plurality of crimp elements comprises:

a body element;

at least one leg element; and

at least one head element, said head element comprising a metal alloy with a plurality of cavities located therein, said plurality of cavities adapted to securely crimp without over-compressing said filament wire during said act of crimping.

13. The method of claim 8, wherein each of said plurality of crimp elements comprises at least one head element, said at least one head element comprising a metal alloy with a plurality of cavities located therein, said plurality of cavities adapted to deform said filament wire into a substantially serpentine shape during said act of crimping without substantially degrading the strength of said filament wire.

14. The method of claim 8, wherein each of said plurality of crimp elements comprises at least one head element, said at least one head element comprising a metal alloy with a plurality of offset arms each separated by a predetermined gap, said plurality of arms adapted to deform said filament into a shape that substantially frustrates movement of said filament within said at least one head element after completion of said act of crimping.

15. A crimped filament assembly, comprising:

at least one crimp element assembly, the at least one crimp element assembly comprising;

a plurality of crimp elements, each of said crimp elements comprising a metal alloy and a plurality of crimp features to retain a filament wire therein; and

a filament wire, said filament wire crimped to at least two of said crimp heads;

wherein said plurality of crimp features retain said filament wire securely without substantially degrading said filament wire so as to preserve the tensile strength of said filament wire; and

a carrier formed of said metal alloy and further comprising a plurality of locating features that facilitate automated processing for said at least one crimp element assembly; and

a carrier tape, said plurality of crimp elements being detachably secured to said carrier tape.

16. The crimped filament assembly of claim 15, wherein at least a portion of said filament wire is disposed adjacent a portion of said carrier tape, said portion of said carrier tape protecting against damage to said filament wire.

17. The crimped filament assembly of claim 16, wherein said carrier tape comprises a plurality of carrier tape locating features, said carrier tape locating features running in a direction substantially parallel with said filament wire.

18. A method for manufacturing a crimped filament assembly, comprising:

providing a plurality of crimp elements;

disposing a filament wire proximate at least one of said plurality of crimp elements;

placing said filament wire under tension;

crimping said filament wire under tension to said at least one crimp elements to form a crimped assembly; and

placing said crimped assembly onto a carrier, said crimped assembly on said carrier comprising said crimped filament assembly;

wherein said carrier comprises a tape, and said crimped assembly is held to said tape in a fixed location via an adhesive, said fixed location being selected to facilitate subsequent processing.

19. The method of claim 18, wherein said carrier comprises a notch formed in an edge thereof, and said act of placing said crimped assembly onto said carrier comprises placing said crimped assembly such that said crimped assembly is received at least partly in said notch, and said filament wire is disposed atop one side of said carrier for at least a majority of its length.

20. A crimped filament assembly, comprising:

at least one crimp element assembly, said at least one crimp element assembly comprising;

a plurality of crimp means, each of said crimp means comprising a metal alloy with a plurality of crimping cavities therein, said plurality of crimping cavities adapted to retain a filament therein; and

a filament, said filament crimped to at least two of said crimp means; and

carrier means comprising a plurality of locating means running in a direction substantially parallel with said filament, said carrier means facilitating the automated processing of said at least one crimp element assembly.

21. The assembly of claim 20, wherein said crimp means have at least one means for picking by a pick-and-place apparatus, and said carrier means comprises a tape means, said carrier means having at least one aperture or notch formed therein in order to expose said at least one means for picking.

22. The assembly of claim 20, wherein said filament comprises a shape memory alloy, and said crimping cavities are disposed to form a substantially serpentine channel that receive at least a portion of said filament.

23. The assembly of claim 22, wherein said filament comprises a Nickel-Titanium shape memory alloy, and said crimp means comprise a material having a hardness less than that of said shape memory alloy so as to preclude substantial deformation of said filament alloy during crimping.

24. The assembly of claim 20, wherein said carrier means is configured to maintain at least one dimension of said crimp element assembly for subsequent processing.

25. The assembly of claim 24, wherein said at least one dimension comprises a spacing between two components.

26. The assembly of claim 20, wherein said carrier means runs adjacent at least a portion of said filament, said adjacent portion of said carrier protecting said filament during product transport.

27. A method for manufacturing a crimped filament assembly comprising a plurality of crimp elements, the method comprising:

a step for disposing a filament wire proximate at least one of said plurality of crimp elements;

a step for tensioning said filament wire;

a step for crimping said filament wire under tension to said at least one crimp elements to form a crimped assembly; and

a step for placing said crimped assembly onto a carrier to form said crimped filament assembly;

wherein said step for placing said crimped assembly onto said carrier comprises a step for placing said crimped assembly such that said crimped assembly can be removed while disposed in a fixed location relative to said carrier.

28. The method of claim 27, wherein said crimping said filament wire under tension to said at least one crimp element comprises crimping at least two adjacent ones of said crimp elements.

29. The method of claim 27, further comprising maintaining a prescribed dimension between at least two of said plurality of crimp elements.

30. The method of claim 27, wherein said disposing comprises movably locating said filament wire into a crimp gap of said at least one crimp element.

31. The method of claim 27, wherein each of said plurality of crimp elements comprises:

a body element;

at least one leg element; and

at least one head element, said head element comprising a metal alloy with a plurality of cavities located therein, said plurality of cavities adapted to securely crimp without over-compressing said filament wire during said act of crimping.

32. The method of claim 27, wherein each of said plurality of crimp elements comprises at least one head element, said at least one head element comprising a metal alloy with a plurality of cavities located therein, said plurality of cavities adapted to deform said filament wire into a substantially serpentine shape during said act of crimping without substantially degrading the strength of said filament wire.

33. The method of claim 27, wherein each of said plurality of crimp elements comprises at least one head element, said at least one head element comprising a metal alloy with a plurality of offset arms each separated by a predetermined gap, said plurality of arms adapted to deform said filament into a shape that substantially frustrates movement of said filament within said at least one head element after completion of said act of crimping.