Cooling system for electronic devices, in particular, computers
First Claim
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1. A cooling system for electronic devices, especially computers, comprising:
- a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6);
wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their top ends;
a plurality of evaporators (1) fitted and connected with the vapor-distribution and condensate-collection element (3), at least a first of said plurality of evaporators disposed vertically lower than the condensate-collection element (3) and at least a second of said plurality of evaporators disposed vertically higher than the condensate-collection element (3);
wherein a first connecting pipe (8) without a heat pipe structure is fitted between the first evaporator (1) and the vapor-distribution and condensate-collection element (3);
wherein a second connecting pipe (7) with an internal heat pipe structure is fitted between the second evaporator (1) and the vapor-distribution and condensate collection element (3); and
wherein the first connecting pipe (8) is connected into the vapor-distribution and condensate-collection element (3) at a height (H) of 0.5 to 1 times a diameter (D) of the second connecting pipe (7) with said heat pipe structure.
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Abstract
The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator (1), a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6), wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their upper ends.
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Citations
6 Claims
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1. A cooling system for electronic devices, especially computers, comprising:
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a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6); wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their top ends; a plurality of evaporators (1) fitted and connected with the vapor-distribution and condensate-collection element (3), at least a first of said plurality of evaporators disposed vertically lower than the condensate-collection element (3) and at least a second of said plurality of evaporators disposed vertically higher than the condensate-collection element (3); wherein a first connecting pipe (8) without a heat pipe structure is fitted between the first evaporator (1) and the vapor-distribution and condensate-collection element (3); wherein a second connecting pipe (7) with an internal heat pipe structure is fitted between the second evaporator (1) and the vapor-distribution and condensate collection element (3); and wherein the first connecting pipe (8) is connected into the vapor-distribution and condensate-collection element (3) at a height (H) of 0.5 to 1 times a diameter (D) of the second connecting pipe (7) with said heat pipe structure.
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2. A cooling system for electronic devices, especially computers, comprising:
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an evaporator (1); a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6); wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their top ends; wherein a connecting pipe (4) is fitted between the evaporator (1) and the vapor-distribution and condensate-collection element (3); and wherein the connecting pipe (4) is designed as a pipe with a heat pipe structure (7) where the condenser (2) is arranged below the evaporator (1) and the pipe with heat pipe structure (7) is connected into the vapor-distribution and condensate-collection element (3.1) with an insertion length (L) of one third to two thirds of the length of the vapor-distribution and condensate-collection element (3.1). - View Dependent Claims (3)
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4. A cooling system for electronic devices, especially computers, comprising:
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a vapor-distribution and condensate-collection element (3) consisting of a horizontal pipe (3.1) and a condenser (2); a plurality of an evaporators (1), at least one of said plurality of evaporators disposed vertically higher than said condenser, and at least another of said plurality of evaporators disposed vertically lower than, said condenser (2); wherein said condenser (2) consists of a plurality of condenser pipes (6) interconnected by a block of radiating fins (5), said condenser pipes (6) arranged parallel to each other and are fitted to extend radially upwards from a surface line of the horizontal pipe (3.1) and having enclosed top ends; wherein each individual evaporator (1) disposed vertically higher than said condenser (2) is coupled to said horizontal pipe (3.1) of the vapor-distribution and condensate-collection element (3) by a connecting pipe (7) having a common diameter (D) and an internal heat pipe structure; and wherein each individual evaporator (1) disposed vertically lower than said condenser (2) is coupled to said horizontal pipe (3.1) of the vapor-distribution and condensate-collection element (3) by a connecting pipe (8) without an internal heat pipe structure. - View Dependent Claims (5, 6)
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Specification