Semiconductor material manufacture
First Claim
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1. A method comprising:
- introducing ions into a donor wafer in proximity to a region of the donor wafer, the region having modifiers, the modifiers being different from bulk material of the donor wafer, the region being disposed at a distance from a surface of the donor wafer;
bonding a product wafer and the donor wafer together; and
irradiating the modifiers with electromagnetic radiation to disunite a bulk region of the donor wafer from the product wafer with the product wafer bonded to a film from the donor wafer, the electromagnetic radiation tuned to a frequency correlated to absorption by the modifiers.
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Abstract
Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can be bonded to the bulk region using electromagnetic radiation. Additional apparatus, systems, and methods are disclosed.
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Citations
10 Claims
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1. A method comprising:
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introducing ions into a donor wafer in proximity to a region of the donor wafer, the region having modifiers, the modifiers being different from bulk material of the donor wafer, the region being disposed at a distance from a surface of the donor wafer; bonding a product wafer and the donor wafer together; and irradiating the modifiers with electromagnetic radiation to disunite a bulk region of the donor wafer from the product wafer with the product wafer bonded to a film from the donor wafer, the electromagnetic radiation tuned to a frequency correlated to absorption by the modifiers. - View Dependent Claims (2, 3, 4, 5)
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6. A method comprising:
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implanting hydrogen ions and/or helium ions into a silicon donor wafer in proximity to a region having modifiers, the modifiers being different from silicon, the region being disposed at a distance from a surface of the donor wafer; bonding a silicon product wafer to the silicon donor wafer such that the surface of the silicon donor wafer bonds to an oxide layer of the silicon product wafer; and exposing the modifiers to microwaves at the hydrogen and/or helium to disunite a bulk region of the silicon donor wafer from the silicon product wafer with the oxide layer of the silicon product wafer bonded to a silicon film from the silicon donor wafer, the microwaves tuned to a frequency correlated to absorption by the modifiers. - View Dependent Claims (7, 8, 9, 10)
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Specification