Ion implantation with heavy halogenide compounds
First Claim
1. A method of plasma doping comprising:
- providing a dopant heavy halogenide compound gas to a plasma chamber;
forming a plasma in the plasma chamber with the dopant heavy halogenide compound gas, the plasma generating desired dopant ions and heavy fragments of precursor dopant molecule;
forming a surface layer on a substrate;
biasing the substrate in the plasma chamber so that the desired dopant ions impact the substrate with a desired ion energy,implanting the desired dopant ions and the heavy fragments of precursor dopant molecule into at least one of the substrate and the film, the desired dopant ions being implanted at a first depth and the heavy fragments of precursor dopant molecule being implanted at a second implant depth, the second implant depth being substantially 20% of the first implant depth or less; and
removing the surface layer after the implanting,wherein at least one of ion energy and a composition of the dopant heavy halogenide compound is chosen so that an implant profile in the substrate is substantially determined by the desired dopant ions.
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Accused Products
Abstract
A method of plasma doping includes providing a dopant gas comprising a dopant heavy halogenide compound gas to a plasma chamber. A plasma is formed in the plasma chamber with the dopant heavy halogenide compound gas and generates desired dopant ions and heavy fragments of precursor dopant molecule. A substrate in the plasma chamber is biased so that the desired dopant ions impact the substrate with a desired ion energy, thereby implanting the desired dopant ions and the heavy fragments of precursor dopant molecule into the substrate, wherein at least one of the ion energy and composition of the dopant heavy halogenide compound is chosen so that the implant profile in the substrate is substantially determined by the desired dopant ions.
24 Citations
25 Claims
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1. A method of plasma doping comprising:
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providing a dopant heavy halogenide compound gas to a plasma chamber; forming a plasma in the plasma chamber with the dopant heavy halogenide compound gas, the plasma generating desired dopant ions and heavy fragments of precursor dopant molecule; forming a surface layer on a substrate; biasing the substrate in the plasma chamber so that the desired dopant ions impact the substrate with a desired ion energy, implanting the desired dopant ions and the heavy fragments of precursor dopant molecule into at least one of the substrate and the film, the desired dopant ions being implanted at a first depth and the heavy fragments of precursor dopant molecule being implanted at a second implant depth, the second implant depth being substantially 20% of the first implant depth or less; and removing the surface layer after the implanting, wherein at least one of ion energy and a composition of the dopant heavy halogenide compound is chosen so that an implant profile in the substrate is substantially determined by the desired dopant ions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of plasma doping comprising:
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forming a surface layer on a substrate; providing a dopant heavy halogenide compound gas to a plasma chamber; forming a plasma in the plasma chamber with the dopant heavy halogenide compound gas, the plasma generating desired dopant ions and heavy fragments of precursor dopant molecule; and biasing a substrate in the plasma chamber and directing the desired dopant ions and the heavy fragments of precursor dopant molecules toward the substrate; implanting desired dopant ions into the substrate at a first ion energy; trapping the heavy fragments precursor dopant molecules in the surface layer; and removing the surface layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of ion implanting comprising:
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forming a surface layer on a substrate; generating dopant and dopant heavy halogenide compound ions; accelerating the dopant and dopant heavy halogenide compound ions; implanting the accelerated dopant and dopant heavy halogenide compound ions into at least one of the surface layer and the substrate with a desired ion energy, the desired dopant ions being implanted at a first implant depth and the dopant heavy halogenide compound ions being implanted at a second implant depth, the second implant depth being substantially 20% of the first implant depth or less; and removing the surface layer after the implanting, wherein an implant profile in the substrate is substantially determined by the first implant depth of the desired dopant ions. - View Dependent Claims (23, 24, 25)
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Specification