Carbon nanotubes for the selective transfer of heat from electronics
First Claim
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1. A method of cooling a circuit element, the method comprising:
- providing a thermal reservoir having a temperature lower than an operating temperature of the circuit element; and
providing a nanotube article in thermal contact with the circuit element and with the reservoir,the nanotube article comprising a non-woven fabric of nanotubes in contact with other nanotubes to define a plurality of thermal pathways along the article,the nanotube article having a nanotube density and a shape selected such that the nanotube article is capable of transferring heat from the circuit element to the thermal reservoir.
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Abstract
Under one aspect, a method of cooling a circuit element includes providing a thermal reservoir having a temperature lower than an operating temperature of the circuit element; and providing a nanotube article in thermal contact with the circuit element and with the reservoir, the nanotube article including a non-woven fabric of nanotubes in contact with other nanotubes to define a plurality of thermal pathways along the article, the nanotube article having a nanotube density and a shape selected such that the nanotube article is capable of transferring heat from the circuit element to the thermal reservoir.
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Citations
39 Claims
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1. A method of cooling a circuit element, the method comprising:
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providing a thermal reservoir having a temperature lower than an operating temperature of the circuit element; and providing a nanotube article in thermal contact with the circuit element and with the reservoir, the nanotube article comprising a non-woven fabric of nanotubes in contact with other nanotubes to define a plurality of thermal pathways along the article, the nanotube article having a nanotube density and a shape selected such that the nanotube article is capable of transferring heat from the circuit element to the thermal reservoir. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a thermal management structure for an integrated circuit, the method comprising:
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depositing a layer of non-woven nanotube fabric on a defined region of the integrated circuit, the layer substantially conforming to the defined region of the integrated circuit and comprising a plurality of nanotubes; and providing a thermal reservoir in thermal contact with at least a portion of the layer of non-woven nanotube fabric, wherein the layer of non-woven nanotube fabric has a nanotube density selected such that the nanotube article is capable of transferring heat from the integrated circuit to the thermal reservoir. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification