MEMS interconnection pins fabrication on a reusable substrate for probe card application
First Claim
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1. A method comprising:
- forming a conductive layer on a substrate;
forming a sacrificial layer on the conductive layer;
forming a Micro-Electro-Mechanical Systems (MEMS) interconnection pin on the sacrificial layer, the MEMS interconnection pin comprising a pin base attached to a frame that has direct contact to the conductive layer, the MEMS interconnection pin further comprising double-sided springs connected to the pin base, the pin base comprising an upper lip and a snatching end for placement in a slot of a plate; and
removing at least partially, the sacrificial layer to detach the MEMS interconnection pin from the substrate.
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Abstract
A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.
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Citations
18 Claims
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1. A method comprising:
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forming a conductive layer on a substrate; forming a sacrificial layer on the conductive layer; forming a Micro-Electro-Mechanical Systems (MEMS) interconnection pin on the sacrificial layer, the MEMS interconnection pin comprising a pin base attached to a frame that has direct contact to the conductive layer, the MEMS interconnection pin further comprising double-sided springs connected to the pin base, the pin base comprising an upper lip and a snatching end for placement in a slot of a plate; and removing at least partially, the sacrificial layer to detach the MEMS interconnection pin from the substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A Micro-Electro-Mechanical Systems (MEMS) interconnection pin for making electrical contacts between two conductive subjects, the MEMS interconnection pin comprising:
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a pin base having a broken surface at one end; two springs extending out from two opposite surfaces of the pin base; and two tip portions, each tip portions attached to an end of one of the springs, each tip portion including one or more contact tips to make contact to one of the conductive subjects, wherein at least one of the springs has two symmetrically curved elements on the same plane. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A Micro-Electro-Mechanical Systems (MEMS) interconnection pin for making electrical contacts between two conductive subjects, the MEMS interconnection pin comprising:
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a pin base comprising an upper lip and a snatching end for placement in a slot of a plate, the upper lip having a broken surface at one end; a spring extending out from a surface of the pin base; and a tip portion attached to an end of the spring, the tip portion including one or more contact tips to make contact to one of the conductive subjects. - View Dependent Claims (17, 18)
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Specification