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Multilevel ground-plane for a mobile device

  • US 7,928,915 B2
  • Filed: 09/20/2005
  • Issued: 04/19/2011
  • Est. Priority Date: 09/21/2004
  • Status: Expired due to Fees
First Claim
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1. A mobile device, comprising:

  • a printed circuit board;

    an antenna radiating element attached to a surface of the printed circuit board; and

    a multilevel ground plane integral with the printed circuit board and electromagnetically coupled to the antenna radiating element;

    the multilevel ground plane comprising;

    a first conducting surface;

    a second conducting surface; and

    a conducting strip that couples the first conducting surface to the second conducting surface;

    wherein at least a portion of the multilevel ground plane defines a space-filling curve;

    wherein the antenna radiating element comprises at least one hole defining an empty area on the antenna radiating element;

    wherein a shape of said empty area is formed by a plurality of polygonal shapes connected or overlapping at a contact region of a perimeter of said plurality of polygonal shapes;

    wherein the contact region between directly connected polygonal shapes of the plurality of polygonal shapes is narrower than 50% of the perimeter of said directly connected polygonal shapes;

    wherein the polygonal shapes of the plurality of polygonal shapes have the same number of sides but not all the polygonal shapes of the plurality of polygonal shapes have the same size;

    wherein at least one edge of the antenna radiating element is aligned with a slot defined between the first conducting surface and the second conducting surface;

    wherein an end of the slot is in contact with a perimetric edge of the multilevel ground plane; and

    wherein at least a part of the at least one hole is positioned over a part of the slot.

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