System and method for wireless communication in a backplane fabric architecture
First Claim
1. A wireless millimeter wave backplane network comprising:
- a first circuit board having a first module thereon, wherein the first circuit board is in a first cabinet structure and coupled to a high speed backplane;
a first communication node coupled to the first module;
a second circuit board having a second module thereon, the second circuit board is in a second cabinet structure separate from the first cabinet structure, wherein the second circuit board is coupled to the high speed backplane; and
a second communication node coupled to the second module, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another between the first and second cabinet structures via the first and second communication nodes.
3 Assignments
0 Petitions
Accused Products
Abstract
A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.
148 Citations
19 Claims
-
1. A wireless millimeter wave backplane network comprising:
-
a first circuit board having a first module thereon, wherein the first circuit board is in a first cabinet structure and coupled to a high speed backplane; a first communication node coupled to the first module; a second circuit board having a second module thereon, the second circuit board is in a second cabinet structure separate from the first cabinet structure, wherein the second circuit board is coupled to the high speed backplane; and a second communication node coupled to the second module, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another between the first and second cabinet structures via the first and second communication nodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method for wirelessly communicating between a plurality of modules in a high speed backplane fabric, the method comprising:
-
selecting a destination communication node of a first cabinet structure to receive a data packet, the destination communication node having at least a receiving antenna and coupled to a first circuit board in the first cabinet structure, wherein the first circuit board is coupled to a high speed backplane; wirelessly transmitting the data packet using millimeter waves from a source communication node of a second cabinet structure separate from the first cabinet structure via a transmitting antenna to the destination communication node, the source communication node coupled to a second circuit board, wherein the second circuit board is coupled to the high speed backplane. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A wireless backplane fabric network comprising:
-
a first circuit board having a first module thereon, the first circuit board in a first cabinet structure; a first communication node coupled to the first module and positioned external to the first cabinet structure; a second circuit board having a second module thereon, wherein the second circuit board is in a second cabinet structure apart from the first cabinet structure; and a second communication node coupled to the second module; a third circuit board having a third module thereon; a third communication node coupled to the third module and disposed on the third circuit board, wherein the first, second and third modules wirelessly autonomously select and communicate within one another via at least two of the first, second and third communication nodes without using a central switching module. - View Dependent Claims (18)
-
-
19. A system for wirelessly communicating between a plurality of modules disposed on one or more circuit boards, the system comprising:
-
means for selecting a destination transceiver node to receive a data packet from a first module on a first circuit board in a first cabinet structure, the destination transceiver node having a receiving antenna external to the first cabinet structure; and means for wirelessly transmitting the data packet via a millimeter wave signal from a source transceiver node of a second cabinet structure to the destination transceiver node of the first cabinet structure, wherein the first and the second cabinet structure are located separate and apart from one another, the source transceiver node autonomously selects the destination transceiver module and transmits thereto without using a central switching module.
-
Specification